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AssigneeSpecialty Coating Systems, Inc.
InventorsWilliam F. Beach, Roger A. Olson, John Wary
Estimating the term…
Chemical vapor deposition apparatus is provided for the quick and efficient deposition of Parylene AF4 onto silicon wafers in the production of semiconductor chips. A method of depositing parylene AF4 onto the surface of a semiconductor wafer includes cooling the semiconductor chip wafer to a temperature below 0.degree. C., creating an inert atmosphere around the apparatus, creating sub-atmospheric pressure conditions around the wafer while maintaining the inert external atmosphere, and depositing a predetermined thickness of the parylene AF4 polymer onto the wafer. The method further includes the steps of heating the wafer back to room temperature prior to removing the wafer from the sub-atmospheric conditions, and may still further include the steps of further heating the wafer to a predetermined annealing temperature, and the cooling the wafer back to room temperature prior to removing the wafer from the sub-atmospheric conditions.
A method for the deposition of a parylene polymer onto a substrate comprising the steps of:
A method for the deposition of a parylene polymer onto a substrate comprising the steps of:
A method for the deposition of a parylene polymer onto a substrate comprising the steps of:
Dependencies are inferred from the claim text.