Package-interface thermal switch

Abstract

The package-interface thermal switch (PITS) is an active temperature cont device for modulating the flow of thermal energy from satellite equipment, such as electronic modules or batteries, to the satellite mounting deck which serves as a heat sink. PITS comprises a mounting bolt made of a shaped memory alloy (SMA) actuating bolt and a non-metallic rod with a helical spring surrounding it forming a mounting bolt for a satellite equipment package. At least four mounting bolts are used for installing the equipment package and are preloaded to a predetermined stress representing the desired thermal conductance between the heat sink and the package. The SMA actuating bolt is in thermal contact with the component or package and expands or contracts as the result of changing package temperature and the helical "return" spring forces against the SMA actuating bolt portion of the PITS, increasing ("hot-on" condition) or decreasing ("cold-off" condition) the pressure of the package against the mounting deck. As the PITS changes its total length, the thermal conductance between the two objects is increased or decreased. Thus thermal conductance changes as a direct function of package temperature, resulting in active temperature control. The simple design of the PITS reduces the cost and weight of the thermal control subsystem in satellites and its high reliability eliminates the requirement for thermal design verification testing.

Dependencies are inferred from the claim text.