Method and apparatus for consolidating organic matrix composites using induction heating

A method for consolidating and forming an organic matrix composite and at an elevated consolidation temperature comprising the steps of:

• (a) laying up a panel formed of an organic matrix composite as a flat sheet of at least one layer of prepreg;
• (b) placing the panel within a susceptor to form a workpiece, the susceptor being susceptible to inducting heating in the presence of a time-varying magnetic field;
• (c) confining the workpiece between dies formed of a material not susceptible to inductive heating;
• (d) creating a time-varying magnetic field around the workpiece to inductively heat the susceptor and thereby to heat the panel to a consolidation temperature of the organic matrix composite panel by conduction of heat from the susceptor to the panel;
• (e) at least partially evacuating a pressure zone within the susceptor around the panel to reduce voids, wrinkles, and flaws in the panel;
• (f) applying a pressure to at least one side of the workpiece;
• and
• (g) consolidating the panel under the applied pressure at the consolidation temperature.

A method for consolidation an organic matrix prepreg under heat and pressure to an organic matrix composite, comprising the steps of:

• (a) sealing a prepreg between at least two sheets of a material susceptible to induction heating;
• (b) exposing the susceptible material to an alternating magnetic flied to induce eddy currents in the material and, thereby, to heat the material substantially uniformly;
• (c) heating the prepreg substantially uniformly by conduction of heat from the susceptible material to the prepreg to raise the prepreg to a consolidation temperature at which the organic matrix prepreg flows to form the organic composite matrix;
• and
• (d) while maintaining the prepreg at the consolidation temperature, applying pressure to the prepreg.

A method for consolidating an organic matrix composite at a consolidation temperature comprising the steps of:

• (a) laying-up prepreg to form an organic matrix composite panel;
• (b) placing the panel adjacent a susceptor susceptible to inductive heating and sealing the panel within the susceptor to define a vacuum pressure zone around the panel, wherein the susceptor and panel form a workpiece;
• (c) inductively heating the susceptor by inducing eddy currents in the susceptor using an alternative magnetic field, wherein the eddy currents heat the susceptor, thereby heating the panel by conduction to the consolidation temperature;
• (d) consolidating the panel at the consolidating temperature by applying pressure to the panel.

A method for consolidating an organic matrix composite at a consolidating temperature comprising the steps of;

• (a) laying-up prepreg to form an organic matrix composite panel;
• (b) placing the panel adjacent a susceptor susceptible to inductive heating, wherein the susceptor and panel form a workpiece;
• (c) inductively heating the susceptor with an alternating magnetic field produced with an induction coil, wherein the workpiece is positioned substantially symmetric around the centerline of the induction coil and wherein the magnetic field induces eddy currents in the susceptor that heat the susceptor and wherein the susceptor conductively heats the panel to the consolidation temperature;
• and
• (d) consolidating the panel at the consolidation temperature by applying pressure to the panel.

A method for consolidating an organic matrix composite at a consolidation temperature comprising the steps of:

• (a) laying-up prepreg to form an organic matrix composite panel;
• (b) placing the panel adjacent a susceptor susceptible to inductive heating, wherein the susceptor and panel form a workpiece;
• (c) inductively heating the susceptor by inducing eddy currents in the susceptor using an alternating magnetic field, wherein the eddy current heats the susceptor, thereby heating the panel to the consolidation temperature;
• (d) consolidating and deforming the panel against a forming surface of a die when at the consolidation temperature by applying a pressure to the panel to deform the susceptor and panel against the forming surface.