Hydroxyl and epoxy polymer, hydrolyzable silicone polymer, either containing flourine monomer

A curable resin composition containing a resin composition and a metal chelate compound, wherein the resin composition comprises from 5 to 95% by weight of a hydroxyl group- and epoxy group-containing compound (F) containing at least two hydroxyl groups on the average per molecule and at least 2 epoxy groups on the average per molecule and having a number average molecular weight of about 1,000 to about 200,000;

• and from 95 to 5% by weight of a compound (C) containing at least one hydrolyzable group directly attached to silicon atom and/or silanol group on the average per molecule and having a number average molecular weight of about 104 to 200,000, at least one of the compound (F) and the compound (C) being a fluorine-containing resin, said fluorine-containing resin comprising as a monomer component
• a fluorine-containing polymerizable unsaturated monomer (c) in an amount of about 1 to about 70% by weight based on the total weight of the components of the resin composition, wherein said monomer (c) is represented by the formula
• CX.sub.2 .dbd.CX.sub.2 ( 5)
• wherein groups X are the same or different and each represents H, Cl, Br, F, an alkyl group or haloalkyl group with the proviso that at least one fluorine atom is present in the molecule, or represented by the formula ##STR112## wherein Z is H or CH.sub.3, R.sup.2 is a fluoroalkyl group and n is an integer of 1 to 10, and the metal chelate compound being contained in an amount of from about 0.01 to about 30 parts by weight per 100 parts by weight of the total amount of compounds (F) and (C) combined.