Heating device for a volatile material with resistive film formed on a substrate and overmolded body

An apparatus for heating a volatile material comprising:

• a substrate;
• a resistive film formed on first and second portions of the substrate;
• first and second conductive leads formed on the substrate engaging the resistive film on the first portion of the substrate;
• first and second electrodes coupled to the first and second conductive leads, respectively;
• third and fourth conductive leads formed on the substrate engaging the resistive film on the second portion of the substrate;
• and
• means coupled to the substrate for encapsulating the resistive film, the conductive leads, and a portion of the first and second electrodes in an insulating material, and for securing the volatile material to be heated adjacent the resistive film, the encapsulating and securing means including a body formed to include first and second generally opposing walls that define a slot in which the volatile material is disposable to secure the volatile material adjacent the resistive film.

A heating apparatus comprising:

• a substrate;
• a resistive film formed on a first portion of the substrate;
• first and second conductive leads formed on the substrate engaging the resistive film;
• first and second electrodes coupled to the first and second conductive leads, respectively;
• an overmolded body made of insulating material formed on the substrate to encapsulate the resistive film, the first and second conductive leads, and a portion of the first and second electrodes;
• and
• an electrical component including first and second conductive leads extending from the electrical component, the electrical component being configured to be slidably inserted between said first and second electrodes so that the first conductive lead engages the first electrode and the second conductive lead engages the second electrode, respectively, to couple the electrical component to the heating apparatus;
• wherein the electrical component includes an insulated housing and the first and second conductive leads extend outwardly from the insulated housing, the insulated housing having first and second contact support posts abutting the first and second conductive leads, the first and second contact support posts holding the first and second conductive leads against the first and second electrodes, respectively, upon insertion of the electrical component between said first and second electrodes;
• and
• further wherein the insulated housing further includes a partition formed between the first and second contact support posts for separating the first conductive lead from the second conductive lead.

A heating apparatus comprising:

• a substrate;
• a resistive film formed on a first portion of the substrate;
• first and second conductive leads formed on the substrate engaging the resistive film;
• first and second electrodes coupled to the first and second conductive leads, respectively;
• an overmolded body made of insulating material formed on the substrate to encapsulate the resistive film, the first and second conductive leads, and a portion of the first and second electrodes;
• an electrical component including first and second conductive leads extending from the electrical component, the electrical component being configured to be slidably inserted between said first and second electrodes so that the first conductive lead engages the first electrode and the second conductive lead engages the second electrode, respectively, to couple the electrical component to the heating apparatus;
• and
• a voltage dropping resistor coupled to the first conductive lead;
• wherein the electrical component includes an insulated housing and the first and second conductive leads extend outwardly from the insulated housing;
• and
• further wherein the insulated housing includes a front portion and a rear portion coupled to the front portion to define an interior region therebetween and a current carrying device positioned within the interior region.

A heating apparatus comprising:

• a substrate;
• a resistive film formed on first and second portions of the substrate;
• first and second conductive leads formed on the substrate engaging the resistive film on the first portion of the substrate;
• first and second electrodes coupled to the first and second conductive leads, respectively;
• third and fourth conductive leads formed on the substrate engaging the resistive film on the second portion of the substrate;
• means coupled to the substrate for encapsulating the resistive film, the conductive leads, and a portion of the first and second electrodes in an insulating material;
• and
• an electrical component including first and second conductive leads extending from the electrical component, the electrical component being configured to be slidably inserted between said first and second electrodes so that the first conductive lead engages the first electrode and the second conductive lead engages the second electrode, respectively, to couple the electrical component to the heating apparatus;
• wherein the electrical component includes an insulated housing and the first and second conductive leads extend outwardly from the insulated housing, the insulated housing having first and second contact support posts abutting the first and second conductive leads, the first and second contact support posts holding the first and second conductive leads against the first and second electrodes, respectively, upon insertion of the electrical component between said first and second electrodes;
• and
• further wherein the insulated housing further includes a partition formed between the first and second contact support posts for separating the first conductive lead from the second conductive lead.

A heating apparatus comprising:

• a substrate;
• a resistive film formed on first and second portions of the substrate;
• first and second conductive leads formed on the substrate engaging the resistive film on the first portion of the substrate;
• first and second electrodes coupled to the first and second conductive leads, respectively;
• third and fourth conductive leads formed on the substrate engaging the resistive film on the second portion of the substrate;
• means coupled to the substrate for encapsulating the resistive film, the conductive leads, and a portion of the first and second electrodes in an insulating material;
• an electrical component including first and second conductive leads extending from the electrical component, the electrical component being configured to be slidably inserted between said first and second electrodes so that the first conductive lead engages the first electrode and the second conductive lead engages the second electrode, respectively, to couple the electrical component to the heating apparatus;
• and
• a voltage dropping resistor coupled to the first conductive lead;
• wherein the electrical component includes an insulated housing and the first and second conductive leads extend outwardly from the insulated housing;
• and
• further wherein the insulated housing includes a front portion and a rear portion coupled to the front portion to define an interior region therebetween and a current carrying device positioned within the interior region.