Semiconductor light emitting device

A semiconductor light emitting device comprising:

• a package stem having a central axis;
• a radiating heatsink block having a lower surface and mounted on said package stem;
• and
• a semiconductor light emitting element having a light emitting point and mounted on said radiating heatsink block wherein the light emitting point of said semiconductor light emitting element is positioned on the central axis of said package stem and only a part of the lower surface of said radiating heatsink block close to the central axis of said package stem is attached to said package stem;

A semiconductor light emitting device comprising:

• a package stem having a central axis.;
• a radiating heatsink block mounted on said package stem;
• a semiconductor light emitting element having a light emitting point and mounted on said radiating heatsink block wherein the light emitting point of said semiconductor light emitting element is positioned on the central axis of said package stem;
• and
• an expansion restricting stopper comprising a material different from said radiating heatsink block disposed on said package stem in contact with said radiating heatsink block.

A semiconductor light emitting device comprising:

• a package stem having a surface with a center;
• a radiating heatsink block mounted on the surface of said package stem;
• and
• a semiconductor laser chip element having a light emitting point and mounted on said radiating heatsink block wherein light emitted from said semiconductor laser chip element forms an acute angle .theta. with the surface of said package stem, wherein a distance from the center of the surface of said package stem measured along the surface to said radiating heatsink block is l1, a height from the center of the surface of said stem to said semiconductor laser chip element along said radiating heatsink block is l2, linear thermal expansion components of said package stem and said radiating heatsink block are .alpha.1 and .alpha.2, respectively, and
• tan.theta.=(l2/l1) and ((l2/l1).sup.2)=(.alpha.1/.alpha.2).

A semiconductor light emitting device comprising:

• a package stem having a surface with a center;
• a radiating heatsink block mounted on the surface of said package stem;
• a semiconductor laser chip element having a light emitting point and mounted on said radiating heatsink block wherein light emitted from said semiconductor laser chid element forms an acute angle .theta. with the surface of said package stem;
• and
• a submount interposed between said semiconductor laser chip element and said radiating heat sink block wherein positional deviation in light emitted by said semiconductor laser chip element due to different linear thermal expansion lengths of said package stem and said radiating heatsink block is compensated by linear thermal expansion of said submount.