Method and apparatus for stressing, burning in and reducing leakage current of electronic devices using microwave radiation

The method of claim I wherein said step of exposing to microwave radiation accelerates defects to failure within said plurality of said electronic devices.

A method for burning-in a plurality of electronic devices selected from the group consisting of a semiconductor chip, a semiconductor wafer, a semiconductor chip packaging substrate and a module containing a semiconductor chip electrically interconnected to a semiconductor chip packaging substrate comprising the steps of:

• exposing each of said plurality of said electronic devices to microwave radiation of frequency from about 100 MHz to about 300 GHz an to a power from about 50 watts to about 600 watts for a period of from about 15 seconds to about 15 minutes to identify defectives over of said plurality of electronic devices.

A method comprising the steps of:

• exposing each of a plurality of electronic devices selected from the group consisting of an integrated chip, a packaging substrate and the combination of an integrated circuit chip electrically mounted to a packaging substrate to microwave radiation to identify defective ones or said plurality of said electronic devices;
• each of said plurality of said electronic devices containing electrically conducting circuits comprising metallization patterns;
• said microwave radiation inducing currents or voltages in said circuits.

A method comprising the steps of:

• providing a plurality of electronic devices;
• exposing each of said plurality of said electronic device to microwave radiation for the purpose selected from the group consisting of electrical stress, thermal stress, burn-in and leakage current reduction to identify defective ones of said plurality of said electronic devices.