Adhesives, adhesive layers for electroless plating and printed circuit boards
AssigneeIbiden Co., Ltd.
InventorsDong D. Wang, Motoo Asai
Life of this patent
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Abstract
An adhesive usable for electroless plating in the formation of printed circuit boards is formed by dispersing a cured heat-resistant resin powder soluble in an acid or an oxidizing agent into an uncured heat-resistant resin matrix hardly soluble in an acid or an oxidizing agent after the curing treatment, in which the heat-resistant resin matrix is a mixture of a thermoplastic resin and an uncured thermosetting resin or an uncured photosensitive resin.
Claims68
An adhesive comprising:
- an uncured heat-resistant resin matrix hardly soluble after curing in an oxidizing agent, said uncured heat-resistant resin matrix comprising a mixture of a thermoplastic resin and an uncured thermosetting resin;
- and
- heat-resistant resin particles soluble in said oxidizing agent dispersed in said uncured heat-resistant resin matrix.
An adhesive comprising:
- an uncured heat-resistant resin matrix hardly soluble after curing in an acid, said uncured heat-resistant resin matrix comprising a mixture of a thermoplastic resin and an uncured thermosetting resin;
- and
- heat-resistant resin particles soluble in said acid dispersed in said uncured heat-resistant resin matrix.
An adhesive comprising:
- an uncured heat-resistant resin matrix hardly soluble after curing in an oxidizing agent, said uncured heat-resistant resin matrix comprising a mixture of a thermoplastic resin and an uncured photosensitive resin;
- and
- heat-resistant resin particles soluble in said oxidizing agent dispersed in said uncured heat-resistant resin matrix.
An adhesive comprising:
- an uncured heat-resistant resin matrix hardly soluble after curing in an acid, said uncured heat-resistant resin matrix comprising a mixture of a thermoplastic resin and an uncured photosensitive resin;
- and
- heat-resistant resin particles soluble in said acid dispersed in said uncured heat-resistant resin matrix.
An adhesive layer for electroless plating on a substrate, said adhesive layer produced by curing of an adhesive comprising an uncured heat-resistant resin matrix hardly soluble after curing in an oxidizing agent, said uncured heat-resistant resin matrix comprising a resin composite of a thermoplastic resin and a thermosetting resin;
- and heat-resistant resin particles soluble in said oxidizing agent dispersed in said uncured heat-resistant resin matrix.
An adhesive layer for electroless plating on a substrate, said adhesive layer produced by curing of an adhesive comprising an uncured heat-resistant resin matrix hardly soluble after curing in an acid, said uncured heat-resistant resin matrix comprising a resin composite of a thermoplastic resin and a thermosetting resin;
- and heat-resistant resin particles soluble in said acid dispersed in said uncured heat-resistant resin matrix.
An adhesive layer for electroless plating formed on a substrate, said adhesive layer produced by curing of an adhesive comprising an uncured heat-resistant resin matrix hardly soluble after curing in an oxidizing agent, said uncured heat-resistant resin matrix comprising a resin composite of a thermoplastic resin and a photosensitive resin;
- and heat-resistant resin particles soluble in said oxidizing agent dispersed in said uncured heat-resistant resin matrix.
An adhesive layer for electroless plating formed on a substrate, said adhesive layer produced by curing of an adhesive comprising an uncured heat-resistant resin matrix hardly soluble after curing in an acid, said uncured heat-resistant resin matrix comprising a resin composite of a thermoplastic resin and a photosensitive resin;
- and heat-resistant resin particles soluble in said acid dispersed in said uncured heat-resistant resin matrix.
A printed circuit board comprising:
- a substrate;
- an adhesive layer comprising a roughened surface formed on said substrate through curing of an adhesive comprising an uncured heat-resistant resin matrix hardly soluble after curing in an oxidizing agent, said uncured heat-resistant resin matrix comprising a resin composite of a thermoplastic resin and a thermosetting resin;
- and heat-resistant resin particles soluble in said oxidizing agent dispersed in said uncured heat-resistant resin matrix;
- and
- a conductor circuit on said roughened surface of said adhesive layer.
A printed circuit board comprising:
- a substrate;
- an adhesive layer comprising a roughened surface formed on said substrate through curing of an adhesive comprising an uncured heat-resistant resin matrix hardly soluble after curing in an acid, said uncured heat-resistant resin matrix comprising a resin composite of a thermoplastic resin and a thermosetting resin;
- and heat-resistant resin particles soluble in said acid dispersed in said uncured heat-resistant resin matrix;
- and
- a conductor circuit on said roughened surface of said adhesive layer.
A printed circuit board comprising:
- a substrate;
- an adhesive layer comprising a roughened surface formed on said substrate through curing of an adhesive comprising an uncured heat-resistant resin matrix hardly soluble after curing in an oxidizing agent, said uncured heat-resistant resin matrix comprising a resin composite of a thermoplastic resin and a photosensitive resin;
- and heat-resistant resin particles soluble in said oxidizing agent dispersed in said uncured heat-resistant resin matrix;
- and
- a conductor circuit on said roughened surface of said adhesive layer.
A printed circuit board comprising:
- a substrate;
- an adhesive layer comprising a roughened surface formed on said substrate through curing of an adhesive comprising an uncured heat-resistant resin matrix hardly soluble after curing in an acid, said uncured heat-resistant resin matrix comprising a resin composite of a thermoplastic resin and a photosensitive resin;
- and heat-resistant resin particles soluble in said acid dispersed in said uncured heat-resistant resin matrix;
- and
- a conductor circuit on said roughened surface of said adhesive layer.
Dependencies are inferred from the claim text.