Plasma processing system and method

A plasma processing system comprising:

• a plasma chamber having plasma generating means, and provided with a material gas supply port through which a material gas is introduced and ionized in said plasma chamber,
• a charge exchange chamber provided with a charge exchange gas supply port through which charge exchange gas is introduced in said charge exchange chamber for neutralizing ions generated by said plasma chamber by charge exchange reaction through a collision with the charge exchange gas, and
• a processing chamber for processing an object to be processed by irradiating neutral particles which are neutralized in said charge exchange chamber,
• wherein said charge exchange chamber and said processing chamber are partitioned with a dielectric porous plate provided with a number of linear microchannel holes having a diameter from 2 .mu.m to 200 .mu.m and a length from 200 .mu.m to 5 mm,
• wherein said porous plate maintains a pressure differential between said charge exchange chamber and said processing chamber,
• wherein said neutral particles pass from said charge exchange chamber to said processing chamber through said microchannel holes, and
• wherein said neutral particles are aligned and focused onto said object.