Fabrication processes for monolithic electronic modules

A process for applying a transfer layer to a planar main surface of a semiconductor chip, said process comprising the steps of:

• (a) providing a workpiece having multiple layers, one layer of said multiple layers comprising the transfer layer;
• (b) temporarily affixing said workpiece to the planar main surface of the semiconductor chip such that the transfer layer is adhered to the planar main surface of the semiconductor chip;
• and
• (c) separating part of the workpiece from the semiconductor chip, said separating being such that the transfer layer remains adhered to the planar main surface of the semiconductor chip.

A process for metallizing a side surface of a semiconductor chip, said process comprising the steps of:

• (a) providing a workpiece;
• (b) affixing the workpiece to the semiconductor chip;
• (c) directly metallizing the side surface of the semiconductor chip to produce a metallization pattern thereon;
• and
• (d) separating the workpiece from the semiconductor chip without damaging the metallization pattern on the side surface of the semiconductor chip.

A process for metallizing a selected side surface and an end surface of an electronic module, said process comprising the steps of:

• (a) providing a workpiece having multiple layers, one layer of said multiple layers comprising a metallization layer;
• (b) temporarily affixing the workpiece to the electronic module such that the metallization layer of the workpiece is bonded to the end surface of the electronic module;
• (c) forming a metallization pattern on the selected side surface of the electronic module;
• and
• (d) separating a part of the workpiece from the electronic module such that the metallization layer remains bonded to the end surface of the electronic module.