Dielectric resonator including a plurality of solder bumps and method of mounting dielectric resonator
AssigneeMurata Manufacturing Co., Ltd.
InventorHisashi Ariyoshi
Life of this patent
Estimating the term…
Abstract
A dielectric resonator device includes a dielectric member, inner conductors provided in the dielectric member, an outer conductor formed on an outer surface of the dielectric member, signal input and output electrodes formed on the outer surface of the dielectric member opposing a mounting substrate and coupled with the inner conductors, and solder bumps formed on the outer conductor on its surface opposing the mounting substrate and on the signal input and output electrodes. By heating the dielectric resonator device opposing the mounting substrate, electrical and mechanical connections may be made therebetween through the solder bumps, while preventing the formation of solder bridges.
Claims19
A dielectric resonator device comprising:
- a dielectric member having an outer surface;
- a plurality of inner conductors provided in the dielectric member;
- an outer conductor disposed on the outer surface of said dielectric member and having a mounting surface;
- signal input and output electrodes disposed on the outer surface of said dielectric member to oppose a mounting substrate and electrically coupled with said inner conductors;
- and
- a plurality of solder bumps disposed on both the mounting surface of the outer conductor and on said signal input and output electrodes, said plurality of solder bumps being located so as to mechanically and electrically connect said outer conductor and said signal input and output electrodes to the mounting substrate when the solder bumps are melted.
A mounting arrangement for mounting a dielectric resonator device on a mounting substrate, said mounting arrangement comprising:
- a) a dielectric resonator device including:
- 1) a dielectric member having an outer surface;
- 2) a plurality of inner conductors provided in the dielectric member;
- 3) an outer conductor disposed on the outer surface of said dielectric member and having a mounting surface;
- 4) signal input and output electrodes disposed on the outer surface of said dielectric member;
- 5) a plurality of solder bumps located on the mounting surface of the outer conductor and on said signal input and output electrodes;
- and
- b) a mounting substrate disposed to oppose said dielectric resonator device and the mounting surface of the outer conductor, said outer conductor and said signal input and output electrodes being connected to said mounting substrate by said plurality of solder bumps through melting thereof.
A method of mounting a dielectric resonator on a mounting substrate having conductive patterns thereon, the dielectric resonator including a dielectric member having a mounting surface, a plurality of inner conductors provided in the dielectric member, an outer conductor being formed on the mounting surface of the dielectric member, the outer conductor having a mounting surface, signal input and output electrodes being electrically isolated from each other and from said other conductor and formed on the mounting surface of the dielectric member and a plurality of solder bumps formed on the mounting surface of the outer conductor and on the signal input and output electrodes, the method comprising the steps of:
- locating the dielectric resonator on the mounting substrate;
- and
- melting the solder bumps located on the mounting surface of the outer conductor and the signal input and output electrodes so that the solder bumps mechanically and electrically connect the conductive patterns to the signal input and output electrodes and the outer conductor.
A method of forming a dielectric resonator comprising the steps of:
- providing a dielectric block;
- forming a plurality of conductor bores in the dielectric block;
- forming a respective inner conductor in each of the plurality of conductor bores;
- forming an outer conductor on the dielectric block as to have a mounting surface;
- forming a signal input electrode and a signal output electrode on the dielectric block such that said signal input electrode and said signal output electrode are electrically isolated from each other and from said outer conductor;
- electrically connecting the signal input electrode and the signal output electrode to respective ones of the plurality of inner conductors;
- and
- forming a plurality of solder bumps on the mounting surface of the outer conductor and on the signal input and output electrodes so that the plurality of solder bumps mechanically and electrically connect the dielectric resonator to a mounting substrate when the plurality of solder bumps are melted.
Dependencies are inferred from the claim text.