Reusable die carrier for burn-in and burn-in process

A reusable carrier for a semiconductor die, which comprises:

• a base having a plurality of carrier contacts for electrical connection of the semiconductor die external of said reusable carrier:
• a plurality of electrically conductive traces on said base, having first ends connected to said carrier contacts for burn-in of the semiconductor die and having second ends positioned to engage die contacts on the semiconductor die;
• a plurality of test electrical contacts on said base for making electrical connection to the semiconductor die for electrical test of the semiconductor die, where the connections between the test electrical contacts and the semiconductor die are in a manner different from the connection between the carrier contacts to the semiconductor die;
• a vacuum port extending through said base to engage the semiconductor die when the semiconductor die is in said means for positioning the semiconductor die;
• and
• a lid configured for removable positioning over said base to cover the semiconductor die.

A process for burn-in of an unpackaged semiconductor die, which comprises:

• providing a reusable carrier for the semiconductor die having a first and a second set of a plurality of contacts on the carrier;
• inserting the semiconductor die in the reusable carrier;
• connecting at least some of the contacts in the first set with the semiconductor die in a first manner;
• establishing the semiconductor die at a desired temperature;
• supplying a burn-in electrical input from a source external of the reusable carder to the contacts connected in said first manner, and through the reusable carrier to the semiconductor die;
• maintaining the semiconductor die at the desired temperature during burn-in;
• placing the semiconductor die in a tester after burn-in;
• connecting at least some of the contacts in the second set with the semiconductor die in a second manner different from the first manner;
• and
• supplying electrical test input electrical signals from a source external of the reusable carrier to the contacts connected in said second manner, and through the reusable carrier to the semiconductor die.