US 5,517,057 A · Electronic modules with interconnected surface metallization layers

Abstract

Methods of fabrication for electronic modules having electrically interconnected side and end surface metallization layers and associated electronic modules are set forth. The methods include providing a stack comprising a plurality of stacked IC chips. A side surface thin-film metallization layer is formed on the stack. Next, an end surface thin-film metallization layer is formed the stack such that the side surface and end surface thin-film metallization layers directly electrically interconnect. Alternatively, each IC chip of a stack may include an end surface metallization layer such that separate formation of an end surface metallization layer on an end surface of the stack is unnecessary. The methods also include forming an electronic module by first providing a long stack of IC chips, testing the chips of the stack, and then segmenting the long stack into multiple small stacks of functional IC chips based upon the test results. Specific details of electronic modules, IC chips contained therein, and stacks composed thereof are also set forth.

Claims19

Dependent claims

An electronic module comprising:

a stack comprising a plurality of stacked integrated circuit ("IC") chips, each integrated circuit chip of said stack having an edge surface, said edge surfaces at least partially defining a first surface of said stack;
a first thin-film metallization layer disposed on said first surface of said stack, said first thin-film metallization layer extending to a second surface of said stack, said second surface being perpendicular to said first surface;
a first insulating layer disposed on said first thin-film metallization layer such that said first thin-film metallization layer is disposed between said first surface of said stack and said first insulating layer;
and
a second thin-film metallization layer disposed on said second surface of said stack, said second thin-film metallization layer extending beyond said first thin film metallization layer such that said second thin-film metallization layer is electrically connected to said first thin-film metallization layer.

2 more elements

An electronic module comprising:

a stack including a plurality of stacked integrated circuit ("IC") chips, at least two IC chips of said stack having a main surface, a transfer metallization layer disposed above said main surface and an end surface metallization layer disposed above said main surface, each IC chip of said stack having an edge surface, said edge surfaces at least partially defining a side surface of said stack;
a first metallization layer disposed on said side surface of said stack and electrically connected to at least some of said at least two IC chips of the stack via said transfer metallization layers, said first metallization layer being electrically connected to the end surface metallization layer of an end IC chip of said stack for facilitating external electrical connectivity to said electronic module through said end surface metallization layer of said end IC chip of said stack;
and
said end surface metallization layer of at least one IC chip, other than said end IC chip, of said at least two IC chips, being electrically insulated from said first metallization layer.

1 more element

Dependencies are inferred from the claim text.

Electronic modules with interconnected surface metallization layers

Life of this patent

Electronic modules with interconnected surface metallization layers

Life of this patent

Abstract

Claims19