Epoxy group-containing silicone resin and compositions based thereon
AssigneeDow Corning Toray Silicone Co., Ltd.
InventorsYoshitsugu Morita, Junji Nakanishi, Ken Tanaka, Toshio Saruyama
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AssigneeDow Corning Toray Silicone Co., Ltd.
InventorsYoshitsugu Morita, Junji Nakanishi, Ken Tanaka, Toshio Saruyama
Estimating the term…
There is disclosed a curable resin composition that has an excellent fluidity prior to curing and that cures to form a molding resin that is flexible, highly moisture resistant, and strongly resistant to heat shock, said composition comprising (A) 100 weight parts of a curable resin; and (B) 0.1 to 500 weight parts of an epoxy group-containing silicone resin that has the general formula (R.sup.1 SiO.sub.3/2).sub.a (R.sup.2 R.sup.3 SiO.sub.2/2).sub.b (SiO.sub.4/2).sub.c wherein R.sup.1, R.sup.2 and R.sup.3 each represents a group selected from the group consisting of an epoxy group-containing organic group and a monovalent hydrocarbon group with the proviso that said epoxy group-containing organic groups comprise 0.1 to 40 mole percent of the total silicon-bonded organic groups in said silicone resin (B), a is a positive number, b is zero or a positive number, c is zero or a positive number, b/a has a value of zero to 10, c/(a+b+c) has a value of zero to 0.3 and said silicone resin (B) has a glass-transition temperature of -90.degree. C. to 150.degree. C.
An epoxy group-containing silicone resin prepared by
Dependencies are inferred from the claim text.