Solvent-free laminating adhesive composition

Abstract

A laminating adhesive comprising an adhesive composition which comprises (a) An epoxidized block copolymer of the formula (A-B-A.sub.p).sub.n -Y.sub.r -(A.sub.q -B).sub.m wherein Y is a coupling agent or coupling monomers, and wherein A and B are polymer blocks which may be homopolymer blocks of conjugated diolefin monomers, copolymer blocks of conjugated diolefin monomers or copolymer blocks of conjugated diolefin monomers and monoalkenyl aromatic hydrocarbon monomers, and wherein the A blocks have a higher number of aliphatic double bonds between a tertiary carbon atom and either a primary, secondary, or tertiary carbon atom per unit of block mass than do the B blocks, and wherein the A blocks have a molecular weight from about 100 to about 3000 and the B blocks have a molecular weight from about 1000 to about 15,000, and wherein p and q are 0 or 1 and n>0, r is 0 or 1, m.gtoreq.0 and n+m ranges from 1 to 100; and (b) at least a significant amount of a tackifying resin compatible with the polymer of (a) up to 400 phr. The invention also relates to a laminate containing the adhesive.

Dependencies are inferred from the claim text.