Process for fabircating an integrated circuit
AssigneeAT&T Corp.
InventorsYinon Degani, Dean P. Kossives
Life of this patent
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Abstract
A process for fabricating devices is disclosed. Numerous devices are formed on a substrate. The substrate is then placed on an adhesive tape mounted on a dicing ring. The devices are then separated into individual chips by dicing the substrate. Prior to dicing, the substrate is coated with a material that is relatively insoluble in water. After the substrate is diced, the coating is removed by rinsing the substrate with an organic solvent in which the material is substantially soluble. The organic solvent dissolves the coating but does not dissolve the adhesive on the tape or otherwise adversely effect the adhesion between the tape and the substrate.
Claims23
A process for dicing a substrate comprising:
- forming an at least semi-transparent coating entirely wherein the substrate has a plurality of devices formed thereon and dicing streets formed therebetween, with a material that is substantially insoluble in water and substantially soluble in alcohol, wherein the material comprises a compound with an organic moiety selected from the group consisting of aliphatic moieties and aromatic moieties and a polar functional group selected from the group consisting of hydroxyl, carbonyl, and carboxyl groups;
- dicing the substrate along the dicing streets;
- and
- rinsing the coated substrate with an organic solvent to remove the coating from the substrate.
A process for fabricating an integrated circuit comprising:
- forming a plurality of devices on a substrate;
- forming dicing streets between the devices on the substrate;
- then
- coating entirely on the substrate with a rosin-containing material that is substantially soluble in alcohol and substantially insoluble in water to form an at least semi-transparent coating on the substrate;
- dicing the substrate along the dicing streets;
- and
- contacting the coating material with an organic solvent to remove the material from the substrate.
Dependencies are inferred from the claim text.