Process for preparing schottky diode contacts with predetermined barrier heights

A process for producing a Schottky diode having a desired barrier height .phi..sub.Bn upon a monocrystalline semiconductive substrate that is comprised of a compound of the formula:

• Al.sub.v Ga.sub.l-v As
• where v is a positive number ranging from and including 0 through 1 inclusive, said process comprising the steps of:
• (a) selecting an alloy subclass from the following class of alloys:
• {.SIGMA.M.sub..delta. }(Al.sub.x Ga.sub.1-lx)
• where:
• .SIGMA.M.sub..delta. is a moiety which consists of at least one M, and when more than one M is present, each M is different,
• M is a metal selected from the group consisting of nickel, cobalt, ruthenium, rhodium, iridium and platinum,
• .delta. is a stoichiometric coefficient whose total value in any given .SIGMA.M.sub..delta. moiety is 1, and
• x is a positive number between 0 and 1 and which said alloy subclass has the capacity in combination with said substrate to exist as a two phase binary equilibrium reciprocal system of the formula:
• {.SIGMA.M.sub..delta. }Ga-{.SIGMA.M.sub..delta. }Al-AlAs-GaAs
• where:
• .SIGMA.M.sub..delta., M and .delta. are as defined above,
• (b) determining the correlation between representative member alloys of said subclass and the respective barrier heights .phi..sub.Bn that are associated with contacts produced therefrom upon a substrate of the formula Al.sub.v Ga.sub.1-v As, and then
• (c) selecting a barrier height .phi..sub.Bn for a Schottky diode;
• (d) comparing said selected barrier height .phi..sub.Bn to said correlation and selecting with said correlation one alloy composition which is within said alloy subclass and which will produce a contact having said selected barrier height .phi..sub.Bn upon said substrate;
• and
• (e) producing with said one alloy composition said contact upon said substrate by a process step sequence of sputtering followed by annealing.

A process for producing a Schottky metal contact for a Schottky diode upon one surface of a monocrystalline semiconductive substrate wherein the interrelationship between the resulting combination comprised of said metal contact and said substrate is such that said combination has a Schottky barrier height .phi..sub.Bn that is in the range of about 0.6 to about 1 eV, said method comprising the steps of:

• (a) sputtering a contact upon a localized surface area of a monocrystalline semiconductive substrate which is comprised of a compound of the formula:
• Al.sub.v Ga.sub.1-v As
• where v is a positive number ranging from and including 0 through 1 inclusive,
• said contact being comprised of an alloy of the formula:
• {.SIGMA.M.sub..gamma. }(Al.sub.x Ga.sub.1-x)
• where:
• .SIGMA.M.sub..delta. is a moiety which consists of at least one M, and when more than one M is present, each M is different,
• M is a metal selected from the group consisting of nickel, cobalt, ruthenium, rhodium, iridium and platinum,
• .delta. is a stoichiometric coefficient whose total value in any given .SIGMA.M.sub..delta. moiety is 1, and
• x is a positive number that ranges from greater than 0 to less than 1;
• said alloy having the capacity when in combination with a substrate compound as defined above to exist as a two phase binary equilibrium reciprocal system having the formula:
• {.SIGMA.M.sub..delta. }Ga-{.SIGMA.M.sub..delta. }Al-AlAs-GaAs
• where:
• .SIGMA.M.sub..delta., M and .delta. are as defined above,
• said sputtering being continued until a layer of said alloy is coated on said area;
• and
• (b) annealing said substrate at a temperature in the range of about 300.degree. C. to about 850.degree. C. for a selected time, the relationship between said alloy and said substrate and said sputtering and said annealing being such that after said annealing:
• a metallic semiconductive interlayer is defined in a region located between said substrate and said alloy,
• said interlayer has a thickness in the range of about 80 to about 105 .ANG., and
• said interlayer contains aluminum, gallium and arsenic;
• thereby to produce said contact upon said substrate, wherein said so produced Schottky metal contact displays in combination with said substrate a Schottky barrier height .phi..sub.Bn that is in said range of about 0.6 to about 1 eV, said process comprising:
• (1) carrying out each of said step (a) and said step (b) sequentially with each one of the alloy members of a series of alloys of one subclass of said alloy formula, said members differing from one another in composition, thereby to produce a metal contact on said substrate for each said alloy member;
• (2) measuring said Schottky barrier height .phi..sub.Bn of each resulting combination comprised of said substrate and each said so produced metal contact, thereby to identify said Schottky barrier height that is so produced with each said alloy member;
• (3) selecting a prechosen Schottky barrier height and comparing said prechosen Schottky barrier height .phi..sub.Bn to said so identified Schottky barrier heights, thereby to identify that one corresponding alloy member within said one subclass which produces said prechosen Schottky barrier height .phi..sub.Bn ;
• and
• (4) sequentially repeating under said controlled conditions each of said step (a) and said step (b) using said one corresponding alloy member, thereby to produce that Schottky metal contact that displays in combination with said substrate said prechosen Schottky barrier height .phi..sub.Bn.

A process for producing a Schottky metal contact for a Schottky diode upon one surface of a monocystalline semiconductive substrate wherein the interrelationship between the resulting combination comprised of said Schottky metal contact and said substrate is such that said combination has a Schottky barrier height .phi..sub.Bn that is a value in the range of about 0.6 to about 1 eV, said method comprising the steps of:

• (a) sequentially repeating each of the following steps (i) and (ii) for each of the member alloys of a series of alloys of one subclass of an alloy of the formula:
• {.SIGMA.M.sub..delta. }(Al.sub.x Ga.sub.1-lx)
• where:
• .SIGMA.M.sub..delta. is a moiety which consists of at least one M, and when more than one M is present, each M is different,
• M is a metal selected from the group consisting of nickel, cobalt, ruthenium, rhodium, iridium and platinum,
• .delta. is a stoichiometric coefficient whose total value in any given .SIGMA.M.sub..delta. moiety is 1, and
• x is a positive number between 0 and 1 (that is, x ranges from greater than 0 to less than 1);
• said alloy having the capacity when in combination with a monocrystalline semiconductive substrate compound of the formula:
• Al.sub.v Ga.sub.1-v As
• where v is a positive number ranging from and including 0 through 1 inclusive, to exist as a two phase binary equilibrium reciprocal system having the formula:
• {.SIGMA.M.sub..delta. }Ga-{.SIGMA.M.sub..delta. }Al-AlAs-GaAs
• where:
• .SIGMA.M.sub..delta., M and .delta. are defined above, said steps (i) and (ii) comprising:
• (i) sputtering a contact upon a localized surface area of one said monocrystalline semiconductive substrate compound, said contact being comprised on an alloy of said alloy formula, said sputtering being continued until said contact comprises a layer of said alloy that is coated on said area;
• and
• (ii) annealing said substrate and said coated contact at a temperature in the range of about 300.degree. to about 850.degree. C. for a selected time the relationship in the resulting combination of each said member alloy and said substrate after said sputtering and said annealing being such that:
• a metallic semiconductive interlayer is defined in a region located between said substrate and said alloy,
• said interlayer has a thickness in the range of about 80 to about 105 .ANG.,
• said interlayer contains aluminum, gallium and arsenic, and
• when interlayer contains aluminum, gallium and arsenic, and
• when a negative bias voltage in the range of about -10 to about 0 volts is applied between an exterior surface of said annealed contact and a portion of said substrate that is in adjacent but spaced relationship to said so annealed contact, no current flows, but when a positive bias voltage in the range of about 0.1 to about 0.7 volts is so applied, a current in the range of about 10.sup.-7 to about 0.5 milliamperes flows through said interlayer thereby to produce a metal contact on said substrate for each said member alloy;
• (b) measuring said Schottky barrier height .phi..sub.Bn of each resulting said combination comprised of said substrate and each said annealed metal contact, thereby to identify said Schottky barrier height .phi..sub.Bn that is produced with each said member alloy;
• (c) selecting a prechosen Schottky barrier height and comparing said prechosen Schottky barrier height .phi..sub.Bn value to said so identified Schottky barrier heights, thereby to identify that one corresponding alloy member within said one subclass which produces said prechosen Schottky barrier height .phi..sub.Bn value;
• and
• (d) sequentially repeating each of said steps (i) and (ii) using said one corresponding alloy member, thereby to produce that Schottky metal contact that displays in combination with said substrate said prechosen Schottky barrier height .phi..sub.Bn value.