Method of forming a composite, article and composition
AssigneeDow Corning Corporation
InventorsRobert C. Camilletti, Loren A. Haluska, Keith W. Michael
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Abstract
The present invention relates to a method of forming composite coatings on electronic substrates and the substrates coated thereby. The method comprises applying a coating comprising hydrogen silsesquioxane resin and a refractory fiber on an electronic substrate and heating the coated substrate at a temperature sufficient to convert the hydrogen silsesquioxane resin into a ceramic.
Claims19
A method of forming a composite coating on an electronic substrate comprising:
- applying a coating composition comprising hydrogen silsesquioxane resin and refractory fibers onto an electronic substrate, wherein the fiber is present in the coating composition in an amount of about 1 to 90 volume percent;
- and
- heating the coated electronic substrate at a temperature sufficient to convert the coating composition into a ceramic coating.
A composition comprising hydrogen silsesquioxane resin and between about 1 and 90 vol. % of a refractory fiber.
Dependencies are inferred from the claim text.