Copper-nickel-tin based alloy
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsKenji Kubosono, Iwao Asamizu, Masazumi Iwase, Toshihiro Kurita
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Abstract
A copper-nickel based alloy, having reduced break-out during casting and reduced cracking during processing in solid state, which consists essentially of 3.1 to 25 wt. % of Ni, 0.1 to 1.5 wt. % of Mn, 0.0001 to 0.0093 wt. % of B, 0.01 to 0.7 wt. % of Si, and from 3 to 10 wt. % of Sn and the remainder being Cu and unavoidable elements.
Claims3
A copper-nickel based alloy, which consists essentially of 3.1 to 25 wt. % of Ni, 0.1 to 1.5 wt. % of Mn, 0.0001 to 0.0093 wt. % of B, and 3 to 10 wt. % of Sn, wherein each of said elements above is in solid solution in said copper-nickel based alloy;
- and
- the remainder being Cu and unavoidable elements.
Dependencies are inferred from the claim text.