Method and apparatus for particle reduction from semiconductor wafers

A method of removing particles from the conductive layer surface of a semiconductor wafer within a clean chamber comprising:

• irradiating said semiconductor wafer by electron flux whereby an electric repulsive force between said semiconductor wafer surface and said particles will remove said particles from said semiconductor wafer surface into the ambient within said clean chamber;
• and
• neutralizing said wafer by applying a ground to said wafer to prevent new particles from being attracted to the cleaned surface of said semiconductor wafer.

A cleaning device to remove particles from the dielectric layer surface of a semiconductor wafer comprising:

• irradiating said semiconductor wafer by electron flux comprising short bursts of electrons wherein said electron flux causes moderate charging to take place on both said particles and said semiconductor wafer surface causing an electric repulsive force between said semiconductor wafer surface and said particles whereby said particles will be removed from said semiconductor wafer surface;
• and
• neutralizing said wafer by irradiation with a hydrogen ion flux to prevent new particles from being attracted to the cleaned surface of said semiconductor wafer.