Apparatus for processing a plurality of circular wafers
AssigneeKabushiki Kaisha Toshiba
InventorMartin Schrems
Life of this patent
Estimating the term…
Abstract
An apparatus for processing a plurality of circular wafers including a tubular heater, a boat and a plurality of heat transfer bodies. The tubular heater has a heating space inside and radiates heat within the heating space. The boat is loaded inside the heating space of the tubular heater and holds the wafers in parallel. Heat transfer bodies are located between the wafers.
Claims53
An apparatus for processing a plurality of wafers each having a center region, comprising:
- a heat chamber;
- a heater surrounding said heat chamber for radiating heat toward said heat chamber;
- a wafer supporting means for loading into said heat chamber and for supporting the plurality of wafers;
- and
- a heat transfer body for mounting between adjacent one of the wafers for exchanging heat with the center regions of the wafers.
An apparatus for processing a plurality of wafers each having a center region, comprising:
- a heat chamber;
- a heater surrounding said heat chamber for radiating heat toward said heat chamber;
- a plurality of heat transfer bodies arranged in parallel and loaded into said heat chamber, for respectively surpporting the wafers in parallel and for exchanging heat with the center regions of the wafers.
An apparatus for processing a plurality of circular wafers comprising:
- a tubular heater having an inner region, for radiating heat toward said inner region;
- a boat for loading into said inner region and for holding the plurality of wafers in parallel;
- and
- a plurality of heat transfer bodies respectively mounted for positioning between the wafers.
An apparatus for processing a plurality of wafers each having a center region, comprising:
- a heat chamber;
- a heater surrounding said heat chamber for radiating heat toward said heat chamber;
- a wafer supporting means for loading into said heat chamber, for supporting the plurality of wafers;
- and
- a heat transfer body connected to said wafer supporting means.
A wafer boat for carrying a plurality of wafers and for loading into a wafer processing heat chamber surrounded by a heater, comprising;
- wafer supporting means for supporting the plurality of wafers;
- and
- a heat transfer body connected to said wafer supporting means for exchanging heat with center region of one of the plurality of wafers.
A dummy wafer inserted between a plurality of circular wafers and held by a wafer boat comprising:
- a circular plate having a diameter similar to the circular wafers;
- and
- a tubular body connected perpendicularly to said circular plate.
A method for heat processing a plurality of wafers each having a center region comprising the steps of:
- forming a stack of said plurality of wafers and a plurality of heat transfer bodies, the stack having an axis;
- radiating heat toward the axis to heat said heat transfer bodies and wafers;
- and
- exchanging heat between said heat transfer bodies and said center regions of said wafers;
A method for heat processing a plurality of wafers comprising the steps of:
- stacking a plurality of heat transfer bodies and a plurality of said wafers to make a wafer stack;
- loading said wafer stack into a heating space of a tubular heater;
- radiating heat within said heating space;
- and
- unloading said wafer stack from said tubular heater.
Dependencies are inferred from the claim text.