Back to results
US 5,516,125 AGranted
Baffled collet for vacuum pick-up of a semiconductor die
AssigneeTexas Instruments Incorporated
InventorRobert G. McKenna
Life of this patent
Estimating the term…
Abstract
A vacuum collet (10) for picking up a semiconductor die (11). A plate (12) has a vacuum tube (15) and a downwardly extending skirt (19). Skirt (19) contacts the perimeter of die (11). The vacuum is distributed to the perimeter of the semiconductor die (10) by a baffle (16) interposed between the plate (12) and the die (11) and within the skirt (19).
Claims20
A vacuum collet for picking-up a semiconductor die, comprising:
- a plate having a vacuum port through which a vacuum may be drawn;
- a skirt extending from said plate for contacting the semiconductor die at its perimeter on its top surface, such that said skirt does not extend vertically beyond said die;
- and
- a baffle interposed between said plate and said die and within said skirt, for directing the airflow of said vacuum such that air is drawn substantially from said perimeter.
1 more element
A method of picking-up a semiconductor die, comprising the steps of:
- drawing a vacuum through a vacuum port of a plate;
- contacting the perimeter of said die on its top surface with the bottom surface of a skirt extending from said plate such that said bottom surface does not extend beyond said die;
- and
- distributing the vacuum, such that the vacuum draws air substantially from said perimeter of said die.
1 more element
A method of picking-up a semiconductor die, comprising the steps of:
- beveling the perimeter of said die;
- drawing a vacuum through a vacuum port of a plate;
- contacting the perimeter of said die on its top surface with the bottom surface of a skirt extending from said plate such that said bottom surface of said skirt does not extend beyond said die, said bottom surface being angled;
- and
- distributing the vacuum, such that the vacuum draws air substantially from said perimeter of said die.
2 more elements
Dependencies are inferred from the claim text.