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US 5,516,032 AGranted
Method for forming bump electrode
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsShoji Sakemi, Tadahiko Sakai
Life of this patent
Estimating the term…
Abstract
The invention relates to a method for forming bump electrodes on an electronic part such as a chip or a substrate. Conventional methods for forming bump electrode had a factor causing high cost, but with the invention, instead of solder balls, low cost solder wires are used, that is, solder wires are cut in a predetermined length, the cut solder wires are vacuum-attracted to the lower face of a pick up head and transferred onto a chip, then the solder pieces transferred are heated to melt, then cooled to solidify and results in forming bump electrodes of hemisphere shape.
Claims9
A method for forming a bump electrode comprising the steps of:
- cutting a solder wire at a predetermined position from the end thereof to obtain a solder piece;
- attracting said solder piece by a pick up head and transferring said solder piece onto a patterning electrode formed at a specific surface on an electronic part;
- heating the solder piece transferred onto said electrode to melt;
- and,
- cooling the solder piece heated to solidify.
2 more elements
A method for forming a bump electrode comprising the steps of:
- deforming specific portion of a solder wire into a flat shape;
- cutting the solder wire of flat shape at a predetermined position from the end thereof to obtain a solder piece;
- attracting said solder piece by a pick up head and transferring said solder piece onto a patterning electrode formed at a specific surface on an electronic part;
- heating the solder piece transferred onto said electrode to melt;
- and,
- cooling the solder piece heated to solidify.
3 more elements
A method for forming a bump electrode comprising the steps of:
- deforming specific portion of a solder wire into a flat shape and at the same time cutting the solder wire at a predetermined position from the end thereof to obtain a solder piece;
- attracting said solder piece by a pick up head and transferring said solder piece onto a patterning electrode formed at a specific surface on an electronic part;
- heating the solder piece transferred onto said electrode to melt;
- and,
- cooling the solder piece heated solidify.
2 more elements
A method for forming a bump electrode comprising the steps of:
- cutting a solder wire at a predetermined position from the end thereof to obtain a solder piece;
- deforming said solder piece into a flat shape;
- attracting said flat solder piece by a pick up head and transferring said solder piece onto a patterning electrode formed at a specific surface on an electronic part;
- heating the solder piece transferred onto said electrode to melt;
- and,
- cooling the solder piece heated to solidify.
3 more elements
A method for forming bump electrodes comprising the steps of:
- arranging a plurality of solder wires parallelly at predetermined pitches and cutting the solder wires at a predetermined position from each of the ends thereof to obtain a plurality of solder pieces;
- attracting said plurality of solder pieces by a pick up head and transferring said plurality of solder pieces onto a plurality of patterning electrodes formed at specific pitches on a specific surface on an electronic part;
- heating the plurality of solder pieces transferred respectively onto said plurality of electrodes to melt;
- and,
- cooling the plurality of solder pieces heated to solidify.
2 more elements
A method for forming bump electrodes comprising the steps of:
- arranging a plurality of solder wires parallelly at predetermined pitches and deforming the portion of said plurality of wires from each of the ends to a predetermined position thereof into flat shapes;
- cutting the solder wires at a predetermined position from the each of ends thereof to obtain a plurality of solder pieces;
- attracting said plurality of solder pieces by a pick up head and transferring said plurality of solder pieces onto a plurality of patterning electrodes formed at specific pitches on a specific surface on an electronic part;
- heating the plurality of solder pieces transferred respectively onto said plurality of electrodes to melt;
- and,
- cooling the plurality of solder pieces heated to solidify.
3 more elements
A method for forming bump electrodes comprising the steps of:
- arranging a plurality of solder wires parallelly at predetermined pitches;
- deforming the portion of said plurality of wires from each of the ends to a predetermined position thereof into flat shapes and at the same time, cutting the solder wires at a predetermined position from the each of ends thereof to obtain a plurality of solder pieces;
- attracting said plurality of solder pieces by a pick up head and transferring said plurality of solder pieces onto a plurality of patterning electrodes formed at specific pitches on a specific surface on an electronic part;
- heating the plurality of solder pieces transferred onto said plurality of electrodes to melt;
- and,
- cooling the plurality of solder pieces heated to solidify.
3 more elements
A method for forming bump electrodes comprising the steps of:
- arranging a plurality of solder wires parallelly at predetermined pitches;
- cutting the solder wires at a predetermined position from each of the ends thereof to obtain a plurality of solder pieces;
- deforming the plurality of solder pieces in flat shapes;
- attracting said plurality of solder pieces by a pick up head and transferring said plurality of solder pieces onto a plurality of patterning electrodes formed at specific pitches on a specific surface on an electronic part;
- heating the plurality of solder pieces transferred onto said plurality of electrodes to melt;
- and,
- cooling the plurality of solder pieces heated to solidify.
4 more elements
A method for forming bump electrodes comprising the steps of:
- arranging a plurality of solder wires parallelly at predetermined pitches;
- cutting the solder wires at a predetermined position from each of the ends thereof to obtain a plurality of solder pieces;
- attracting said plurality of solder pieces by a pick up head and transferring said plurality of solder pieces onto a plurality of patterning electrodes formed in a matrix at specific pitches on a specific surface on an electronic part;
- heating the plurality of solder pieces transferred onto said plurality of electrodes of the matrix to melt;
- and,
- cooling the plurality of solder pieces heated to solidify.
3 more elements
Dependencies are inferred from the claim text.