Soldering method and apparatus for use in connecting electronic circuit devices
AssigneeHitachi, Ltd.
InventorsToru Nishikawa, Masahito Ijuin, Ryohei Sato, Mitsugu Shirai
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Abstract
In order to remove oxide film and contamination film on members to be bonded by soldering and solder material therefor corresponding to variation of thickness thereof by sputter-etching in a fluxless bonding method and apparatus therefor, substance emitted from the solder material under sputter-etching using atom or ion is detected and determined whether it is from the solder material or from the oxide film thereon. The sputter-etching is controlled on the basis of the determination to remove the oxide film. Then, the members are aligned in oxidizing atmosphere and soldered in non-oxidizing atmosphere.
Claims27
A method of soldering for use in fabricating an electronic circuit device, comprising the steps of:
- removing an oxide layer from a surface of a soldering material by sputter-etching of the soldering material with atom or ion, said removing including detecting substance emitted from the soldering material, determining whether the detected substance is from the oxide layer on the soldering material or from the soldering material and controlling the sputter-etching according to the determination;
- aligning members to be bonded by the soldering material in an oxidizing atmosphere;
- and
- heating said soldering material and performing a soldering operation in non-oxidizing atmosphere.
A soldering apparatus for use in fabricating an electronic circuit device, comprising:
- means for removing an oxide layer from a surface of a soldering material by sputter-etching of the soldering material with atom or ion, said means for removing including detecting a substance emitted from the soldering material, determining whether the detected substance is from the oxide layer on the soldering material or from the soldering material and controlling the sputter-etching according to the determination;
- aligning means for aligning members to be bonded by the soldering material in an oxidizing atmosphere;
- and
- heating means for heating said soldering material and performing a soldering operation in non-oxidizing atmosphere.
Dependencies are inferred from the claim text.