Method and apparatus for bonding a semiconductor device
AssigneesSGS-Thomson Microelectronics S.A., Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno
InventorsAntonino Grasso, Antonio Pinto
Life of this patent
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Abstract
A method for connecting a wire lead between a semiconductor circuit chip and a corresponding terminal connector of a semiconductor device includes providing a bonding tool having a working end formed with at least a pair of grooves of different length, holding one end of the wire lead to the pin of the semiconductor device in one of said grooves and bonding it, and holding the other end of said wire to the chip in the other of said grooves an bonding it. The grooves have different lengths to allow for different wire spans across the bonded connection areas, on the chip and the pins.
Claims16
A method for connecting a wire lead between a respective pad on a semiconductor chip and a corresponding terminal pin of a semiconductor device comprising the steps of:
- providing a bonding tool including a working end having a surface with a width, a first length, and a second length, the first and second lengths of the surface being different, the first length of the surface having a first groove and the second length of the surface having a second groove;
- holding a first end of the wire lead to the terminal pin in the first groove and bonding the wire to the terminal pin;
- and
- holding a second end of the wire to the bonding pad of the semiconductor chip and bonding it to the respective bonding pad.
A bonding tool, for use with bonding equipment operated in a stitch bonding mode, for bonding a wire lead between a bonding pad of a semiconductor chip and a corresponding terminal pin of a semiconductor device, wherein the bonding tool comprises a bonding tip, including an end having a surface with a width, a first length, and a second length, the first length of the surface having a first wire-holding groove and the second length of said surface having a second wire-holding groove, the first wire holding groove and the second wire-holding groove having different lengths.
A bonding tool, for use with bonding equipment operated in a stitch bonding mode, for bonding a wire lead between a bonding pad of a semiconductor chip and a corresponding terminal pin of a semiconductor device, wherein the bonding tool comprises a bonding tip having a first end formed with a first wire-holding groove and a second wire-holding groove, the first wire holding groove and the second wire-holding groove having different lengths, wherein the first groove has a length is in a range of one third to one half longer than a length of the second groove.
A bonding tool, for use with bonding equipment operated in a stitch bonding mode, for bonding a wire lead between a bonding pad of a semiconductor chip and a corresponding terminal pin of a semiconductor device, wherein the bonding tool comprises a bonding tip having a first end formed with a first wire-holding groove and a second wire-holding groove, the first wire-holding groove and the second wire-holding groove having different lengths, wherein the first wire-holding groove and the second wire-holding groove are substantially V-shaped in cross-section with a flare angle of substantially sixty degrees.
A method for bonding a respective bonding area on a semiconductor chip to a respective pin of a semiconductor device, comprising the steps of:
- holding a wire lead in a first groove of a bonding tool, the first groove having a first length:
- forming a first bonding contact between the wire lead and the respective pin;
- holding a second end of the wire lead in a second groove of the bonding tool, the second groove having a second length, the first length being in the range of 1/3 to 1/2 longer than the second length;
- and
- forming a second bonding contact between the wire lead and the respective bonding area on the semiconductor chip.
A bonding tool for use with bonding equipment operated in a stitch bonding mode, for bonding a wire lead between a bonding pad of a semiconductor chip and a corresponding terminal pin of a semiconductor device, wherein the bonding tool comprises a bonding tip including an end having a surface with a width, a first length, and a second length, the first and second lengths being different, the first length of the surface having a first means for holding a wire lead and the second length of the surface having a second means for holding the wire lead.
A bonding tool for use with bonding equipment operated in a stitch bonding mode, for bonding a wire lead between a bonding pad of a semiconductor chip and a corresponding terminal pin of a semiconductor device, wherein the bonding tool comprises a bonding tip having a first end formed with a first means for holding a wire lead and a second means for holding the wire lead, wherein the first wire holding means has a length in a range of 1/3 to 1/2 longer than a length of the second wire holding means.
Dependencies are inferred from the claim text.