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AssigneeSumitomo Electric Industries, Ltd.
InventorsKeiichiro Tanabe, Toshiya Takahashi, Akihiko Ikegaya, Naoji Fujimori
Estimating the term…
A bonding tool has a head portion made essentially of vapor-deposited diamond, wherein a principal diamond crystal plane forming a head face is a (111) plane. Such a head face has high hardness and a good wear resistance. In order to improve the toughness of a bonding head which is mainly made of vapor-deposited diamond, a portion or ply forming the head face consists essentially of high-purity diamond, and another portion or ply supporting the head face consists essentially of low-purity diamond. The head face has a high rigidity, while the portion supporting the head face has a high toughness. In order to provide a bonding head portion which is mainly made of vapor-deposited diamond with electrical conductivity, a first portion or ply forming a head face consists essentially of polycrystalline diamond containing a relatively small amount of dopant, and another portion or ply supporting the first portion or ply contains a large amount of dopant. The head portion having electrical conductivity can be heated by energization. In a tool employing a coating containing vapor-deposited diamond as a bonding head portion, the coating is formed by a compound of a metal or ceramics and vapor-deposited diamond, in order to improve the strength of the coating and adhesion to a tool substrate.
A bonding tool comprising a bonding head having a head face for performing bonding work and consisting essentially of vapor-deposited polycrystalline diamond and a non-diamond component formed during vapor deposition of said diamond, and a substrate holding said bonding head, wherein said bonding head comprises a first head portion forming said head face and a second head portion disposed in contact with said first head portion and containing a larger proportion of said non-diamond component than does said first head portion, and wherein said head face has a surface roughness R.sub.max of not more than about 0.1 .mu.m.
A bonding tool comprising a bonding head having electrical conductivity and consisting essentially of vapor-deposited polycrystalline diamond and a dopant, and a substrate holding said bonding head, wherein said bonding head comprises a first head portion forming a head face for performing bonding work and a second head portion disposed in contact with said first head portion and containing a larger proportion of said dopant than does said first head portion.
A bonding tool comprising a substrate, and a bonding head that partially coats said substrate and that consists essentially of vapor-deposited poly-crystalline diamond and at least one component selected from metals and ceramics, wherein said component has a thermal expansion coefficient closer to that of said substrate than that of said polycrystalline diamond, said bonding head comprises a first portion forming a head face for performing bonding work and a second portion adhering to said substrate, said first portion consists essentially of said polycrystalline diamond, said second portion has a reduced proportional content of said polycrystalline diamond and an increased proportional content of said at least one component, and said head face has a surface roughness R.sub.max of not more than about 0.1 .mu.m.
A method of manufacturing a bonding tool having an electrically conductive bonding head including a flat bonding face, comprising:
A method of manufacturing a bonding tool having an electrically conductive bonding head including a flat bonding face, comprising:
A method of manufacturing a bonding tool, comprising:
Dependencies are inferred from the claim text.