Ink jet printhead with sealed manifold and printhead die
AssigneeXerox Corporation
InventorsLawrence H. Herko, Peter J. Nystrom
Life of this patent
Estimating the term…
Abstract
The contiguous inlets of components of a thermal ink jet printhead are sealed by applying a sealant to provide a substantial but not complete seal around the edge of an inlet of the printhead die mounted on a heater plate to provide an edge free of sealant and by injecting a liquid encapsulant to seal the contiguous inlets of the die and a manifold at the edge free of sealant.
Claims27
A thermal ink jet printhead comprising:
- a heat sinking substrate;
- a heater plate with wire bond pads and mounted on the substrate;
- a printhead die mounted on the heater plate and comprising a channel section with an ink inlet, wherein, at least a portion of an edge around the ink inlet, a width of the edge has insufficient surface area to support sealant;
- an interconnection board bonded to the substrate and having wire bond pads corresponding to the pads of said heater plate;
- a plurality of wire bonds electrically interconnecting the wire bond pads on the heater plate and the interconnection board;
- a manifold mounted to the substrate with an inlet contiguous with the inlet of said printhead die and overlapping said die and heater plate to form a cavity between said heater plate and said manifold;
- a sealant applied to edges of the contiguous inlets between said manifold and said die, substantially but not completely around said edges with at least a portion of the edges being free of said sealant;
- and
- an encapsulant encapsulating said wire bonds, at least partially filling said cavity, and at least partially sealing said contiguous inlets at said portion of the edges free of said sealant to form a continuous passageway between said inlets.
A method of sealing components of a thermal ink jet printhead having a heater plate and an interconnection board mounted on a substrate, the method comprising the steps of:
- applying a sealant to provide a substantial but not complete seal around an edge of an inlet of a printhead die mounted on the heater plate, wherein at at least one portion of said edge, a width of said edge is substantially free of said sealant;
- positioning a manifold having an inlet contiguous with the inlet of said printhead die on the substrate over the interconnection board and the printhead die to form a cavity defined between at least a portion of said heater plate and said manifold;
- and
- injecting a liquid encapsulant into said cavity to encapsulate wire bonds between said heater plate and said interconnection board and simultaneously to at least partially fill said cavity and to at least partially seal the contiguous inlets of said die and said manifold at said portion of the edge free of said sealant to form a continuous passageway between said inlets.
A method of sealing components of a thermal ink jet printhead having a heater plate and an interconnection board mounted on a substrate, the method comprising the steps of:
- applying a sealant to provide a substantial but not complete seal around an edge of an inlet of a manifold, wherein at at least one portion of said edge, a width of said edge is substantially free of said sealant;
- positioning said manifold on the substrate over the interconnection board and a printhead die mounted on the heater plate, said printhead die having an inlet, to form a cavity defined between at least a portion of said heater plate and said manifold, and said inlet of said manifold contiguous with said inlet of said printhead die;
- and
- injecting a liquid encapsulant into said cavity to encapsulate wire bonds between said heater plate and said interconnection board and simultaneously to at least partially fill said cavity and to at least partially seal the contiguous inlets of said die and said manifold at said portion of the edge free of said sealant to form a continuous passageway between said inlets.
Dependencies are inferred from the claim text.