Heat dissipating housing for current

A housing for an electronics package having an array of electrical and electronic components mounted on a circuit board, comprising:

• a support member and an outer shell member adapted to be secured together at an assembly interface to define therebetween a cavity for enclosing and housing therewithin the electronics package, at least said outer shell member being formed of thermally conductive material;
• said outer shell including an assembly face at said assembly interface and an opposed outer surface and adjacent side surfaces, and further including a connector face for electrically connecting said electronics package to another article after complete assembly;
• and
• said assembly face of said outer shell including a package-adjacent surface including a plurality of component-receiving recesses thereinto, said package-adjacent surface thereby being shaped and contoured to complement the shape and contour of the components of said electronics package closely adjacent therewith,
• whereby said outer shell is especially adapted to receive heat from said electronics package during in-service use thereof, for dissipation of thermal energy thereby enhancing long-term in-service use.