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US 5,514,913 AGranted
Resin-encapsulated semiconductor device having improved adhesion
AssigneeConsorzio per la Ricerca sulla Microelettronica net Mezzogiorno
InventorsMarcantonio Mangiagli, Rosario Pogliese
Life of this patent
Estimating the term…
Abstract
A package for discrete semiconductor devices, wherein the insulating characteristics of the package are improved by introducing an opening, indentations, grooves and positioning holes in the metal plate and shaping in appropriate form the retractable positioning pins of the metal plate in the molding die.
Claims26
An insulated electronic device package, comprising:
- a thermally conductive plate having a through hole therein in proximity to a first edge thereof, and a tapered opening in said first edge which in its innermost part radiuses with said through hole;
- an electronic device attached to a first surface of said plate;
- a polymer body completely enclosing said electronic device, and also enclosing said plate near said electronic device;
- said polymer body including a through hole therethrough which extends through said through hole of said plate;
- at least one conductive finger extending from the interior to the exterior of said polymer body, and electrically connected to said electronic device within said polymer body;
- wherein said plate further comprises lateral indentations in second and third edges thereof which are adjacent to said first edge.
3 more elements
An insulated electronic device package, comprising:
- a thermally conductive plate having a through hole therein in proximity to a first edge thereof, and an opening in said first edge which in its innermost part radiuses with said through hole and which has an extension mouth not smaller than the diameter of said through hole, and which connects said through hole to said first edge of said plate, and wherein said plate further comprises lateral indentations in second and third edges thereof which are adjacent to said first edge;
- an electronic device attached to a first surface of said plate;
- a polymer body completely enclosing said electronic device, and also enclosing said plate;
- said polymer body including a through hole therethrough which extends through said through hole of said plate;
- at least two conductive fingers extending from the interior to the exterior of said polymer body, and electrically connected to said electronic device within said polymer body;
- wherein said plate comprises multiple longitudinal channels in a second surface thereof, opposite to said first surface.
3 more elements
An insulated electronic device package, comprising:
- a thermally conductive plate having a through hole therein in proximity to a first edge thereof, and an opening in said first edge which in its innermost part radiuses with said through hole, and which has an extension mouth not smaller than the diameter of said through hole, and wherein said plate further comprises lateral indentations in second and third edges thereof which are adjacent to said first edge;
- a electronic device attached to a first surface of said plate;
- a polymer body completely enclosing said electronic device, and also enclosing said plate near said electronic device;
- said polymer body including a through hole therethrough which extends through said through hole of said plate;
- at least one conductive finger extending from the interior to the exterior of said polymer body, and electrically connected to said electronic device within said polymer body;
- wherein a second surface of said plate, opposite to said first surface, includes first and second flat portions which are parallel but not coplanar.
3 more elements
A semiconductor device comprising:
- a metal plate comprising a through hole in proximity to a first edge thereof, and an external connector extending from an additional edge thereof, and an opening in said first edge which in its innermost part radiuses with said through hole and which has an extension mouth not smaller than the diameter of said through hole, and wherein said plate further comprises lateral indentations in second and third edges thereof which are adjacent to said first edge;
- a semiconductor chip brazed to a first surface of said metal plate;
- and
- a resin enclosure surrounding said chip and said plate in proximity to said chip;
- wherein the surface of said plate opposite said first surface has a stepped lowering near said first edge.
2 more elements
Dependencies are inferred from the claim text.