Microcavity structures, fabrication processes, and applications thereof
AssigneeInternational Business Machines Corporation
InventorsMichael S. Dusablon, Sr., Eric J. White
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Abstract
A method is presented for controlled formation of microcavities for various semiconductor and micro-machine applications. The method involves the steps of defining a void in a support structure, sealing the void with a resilient gas-permeable material such that a chamber is formed, diffusing gas into the chamber through the gas permeable material to create a pressurized chamber, and then allowing expansion of the pressurized chamber within the resilient material, thereby creating an enlarged cavity. The applications set forth include the production of large capacitors, field isolation structures, tubular sensors for chromatography, pressure sensors, and cooling channels for integrated circuits.
Claims12
A semiconductor structure comprising:
- a semiconductor substrate having a void therein;
- and
- a dielectric material disposed above said semiconductor substrate such that said dielectric material fills said void in said semiconductor substrate, said dielectric material containing a cavity therein disposed above said void in said semiconductor substrate, said cavity having a size larger than said void in said semiconductor substrate.
Dependencies are inferred from the claim text.