Solvent-less vapor deposition apparatus and process for application of soldering fluxes
AssigneeFord Motor Company
InventorsGuilian Gao, Peter J. Sinkunas, Brenda J. Nation, Myron Lemecha, Lawrence Kneisel
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Abstract
Apparatus and method for condensing a solderless flux vapor onto a work surface to be soldered, such as an electronic circuit board. The flux vapor is created by heating flux in a liquid state to a temperature greater than the temperature of the work surface. Flux is applied to the work surface without the use of any volatile organic chemicals.
Claims20
A process for applying flux to a solder work surface having a predetermined temperature comprising in combination the steps of:
- providing a solventless source of flux in a liquid phase in a flux reservoir from a solid or liquid flux stable at ambient temperature;
- creating a flux vapor in a flux application zone by heating said flux in said flux reservoir, said flux vapor being at a temperature greater than said predetermined temperature;
- passing said work surface through said application zone, so that said flux vapor condenses on said work surface, whereby flux is applied to said work surface without the use of any volatile organic chemicals.
Apparatus for applying flux to a solder work surface having a predetermined temperature comprising in combination:
- means for providing a solventless source of flux in a liquid phase in a flux reservoir from a solid or liquid flux stable at ambient temperature;
- means for creating a flux vapor in a flux application zone by heating said flux in said flux reservoir, said flux vapor being at a temperature greater than said predetermined temperature;
- and
- means for passing said work surface through said application zone, so that said flux vapor condenses on said work surface, whereby flux is applied to said work surface without the use of any volatile organic chemicals.
Dependencies are inferred from the claim text.