Fine lead alloy wire for forming bump electrodes

A fine alloy wire for forming bump electrodes using a wire bonder, said fine wire comprising a Pb alloy comprising Pb-Ag-Cu including 3 wt % of Ag, 0.9 wt % of Cu, and 0.001 wt % to 50 wt % of at least one additional element selected from the group consisting of Sn, In, Be, B, C, Mg, Al, Si, P, Ca, Ti, V, Cr, Mn, Fe, Co, Ni, Zn, Ga, Ge, Se, Zr, Nb, Mo, Pd, Cd, Sb, Te, Ir, Pt, Au, Tl, Bi, and mixtures thereof, and a balance of Pb, and said fine wire is made under a rapid cooling and condensation process having a time of 10.sup.3 .degree. to 10.sup.5 .degree. C./sec.

A fine alloy wire for forming bump electrodes using a wire bonder, said fine wire comprising a Pb alloy comprising Pb-Sn-Ag-Cu including 0.3 to 50 wt % of Sn, 0.5 to 10 wt % of Ag, 0.1 to 0.9 wt % of Cu, and 0.001 wt % to 50 wt % of at least one additional element selected from the group consisting of In, Be, B, C, Mg, Al, Si, P, Ca, Ti, V, Cr, Mn, Fe, Co, Ni, Zn, Ga, Ge, Se, Zr, Nb, Mo, Pd, Cd, Sb, Te, Ir, Pt, Au, Tl, Bi, and mixtures thereof, and a balance of Pb, and said fine wire is made under a rapid cooling and condensation process having a time of 10.sup.3 .degree. to 10.sup.5 .degree. C./sec.

A fine alloy wire for forming bump electrodes using a wire bonder, said fine wire comprising a Pb alloy comprising Pb-Sn-Cr-Cu including 0.5 to 2 wt % of Sn, 3 wt % of Cr, 0.9 wt % of Cu, and 0.001 wt % to 50 wt % of at least one additional element selected from the group consisting of In, Be, B, C, Mg, Al, Si, P, Ca, Ti, V, Mn, Fe, Co, Ni, Zn, Ga, Ge, Se, Zr, Nb, Mo, Pd, Ag, Cd, Sb, Te, Ir, Pt, Au, Tl, Bi, and mixtures thereof, and a balance of Pb, and said fine wire is made under a rapid cooling and condensation process having a time of 10.sup.3 .degree. to 10.sup.5 .degree. C./sec.

A fine alloy wire for forming bump electrodes using a wire bonder, said fine wire comprising a Pb alloy comprising Pb-Sn-Ag-Ni including 0.5 to 5 wt % of Sn, 2 to 5 wt % of Ag, 0.1 to 5 wt % of Ni, and 0.001 wt % to 50 wt % of at least one additional element selected from the group consisting of In, Be, B, C, Mg, Al, Si, P, Ca, Ti, V, Cr, Mn, Fe, Co, Cu, Zn, Ga, Ge, Se, Zr, Nb, Mo, Pd, Cd, Sb, Te, Ir, Pt, Au, Tl, Bi, and mixtures thereof, and a balance of Pb, and said fine wire is made under a rapid cooling and condensation process having a time of 10.sup.3 .degree. to 10.sup.5 .degree. C./sec.

A fine alloy wire for forming bump electrodes using a wire bonder, said fine wire comprising a Pb alloy comprising Pb-Sn-Sb including 1 to 50 wt % of Sn, 1 to 8 wt % of Sb, and 0.001 wt % to 50 wt % of at least one additional element selected from the group consisting of In, Be, B, C, Mg, Al, Si, P, Ca, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Se, Zr, Nb, Mo, Pd, Ag, Cd, Te, Ir, Pt, Au, Tl, Bi, and mixtures thereof, and a balance of Pb, and said fine wire is made under a rapid cooling and condensation process having a time of 10.sup.3 .degree. to 10.sup.5 .degree. C./sec.

A fine alloy wire for forming bump electrodes using a wire bonder, said fine wire comprising a Pb alloy comprising Pb-Sn-Sb-Ag including 1 to 50 wt % of Sn, 1 to 8 wt % of Sb, 2 to 10 wt % of Ag, and 0.001 wt % to 50 wt % of at least one additional element selected from the group consisting of In, Be, B, C, Mg, Al, Si, P, Ca, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Se, Zr, Nb, Mo, Pd, Ag, Cd, Te, Ir, Pt, Au, Tl, Bi, and mixtures thereof, and a balance of Pb, and said fine wire is made under a rapid cooling and condensation process having a time of 10.sup.3 .degree. to 10.sup.5 .degree. C./sec.

A fine alloy wire for forming bump electrodes using a wire bonder, said fine wire comprising a Pb alloy comprising Pb-Sn-Ag-Cu-Sb including 1 to 50 wt % of Sn, 2 to 10 wt % of Ag, 0.1 to 0.9 wt % of Cu, 1 to 8 wt % of Sb, and 0.001 wt % to 50 wt % of at least one additional element selected from the group consisting of In, Be, B, C, Mg, Al, Si, P, Ca, Ti, V, Cr, Mn, Fe, Co, Ni, Zn, Ga, Ge, Se, Zr, Nb, Mo, Pd, Ag, Cd, Te, Ir, Pt, Au, Tl, Bi, and mixtures thereof, and a balance of Pb, and said fine wire is made under a rapid cooling and condensation process having a time of 10.sup.3 .degree. to 10.sup.5 .degree. C./sec.

A fine alloy wire for forming bump electrodes using a wire bonder, said fine wire comprising a Pb alloy comprising Pb-Sn-Au-Sb-Cu including 2 to 50 wt % of Sn, 0.001 to 0.5 wt % of Au, 0.01 to 5 wt % of Sb, 0.01 to 1.5 wt % of Cu, and 0.001 wt % to 50 wt % of at least one additional element selected from the group consisting of In, Be, B, C, Mg, Al, Si, P, Ca, Ti, V, Cr, Mn, Fe, Co, Ni, Zn, Ga, Ge, Se, Zr, Nb, Mo, Pd, Ag, Cd, Te, Ir, Pt, Tl, Bi, and mixtures thereof, and a balance of Pb, and said fine wire is made under a rapid cooling and condensation process having a time of 10.sup.3 .degree. to 10.sup.5 .degree. C./sec.

A fine alloy wire for forming bump electrodes using a wire bonder, said fine wire comprising a Pb alloy comprising Pb-In-Au including 5 to 50 wt % of In, 0.1 to 5 wt % of Au, and 0.001 wt % to 50 wt % of at least one additional element selected from the group consisting of Sn, Be, B, C, Mg, Al, Si, P, Ca, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Se, Zr, Nb, Mo, Pd, Ag, Cd, Sb, Te, Ir, Pt, Tl, Bi, and mixtures thereof, and a balance of Pb, and said fine wire is made under a rapid cooling and condensation process having a time of 10.sup.3 .degree. to 10.sup.5 .degree. C./sec.

A fine alloy wire for forming bump electrodes using a wire bonder, said fine wire comprising a Pb alloy comprising Pb-In-Cu including 5 to 50 wt % of In, 0.1 to 5 wt % of Cu, and 0.001 wt % to 50 wt % of at least one additional element selected from the group consisting of Sn, Be, B, C, Mg, Al, Si, P, Ca, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Se, Zr, Nb, Mo, Pd, Ag, Cd, Sb, Te, Ir, Pt, Au, Tl, Bi, and mixtures thereof, and a balance of Pb, and said fine wire is made under a rapid cooling and condensation process having a time of 10.sup.3 .degree. to 10.sup.5 .degree. C./sec.