Powder metal heat sink for integrated circuit devices
AssigneeLSI Logic Corporation
InventorMark R. Schneider
Life of this patent
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Abstract
Apparatus for use in cooling an integrated circuit structure. The apparatus includes a heat sink having a first portion configured for thermal engagement with an integrated circuit device and a second portion configured for the dissipation of heat into an ambient fluid, such as air. The heat sink is made from a powdered metal which, in one preferred embodiment, includes copper. The heat sink may be formed from the plurality of discrete layers, each layer having a button projecting from one surface, and a depression formed in an opposing surface. The depression is configured to receive a projecting button portion from another layer. In an alternative embodiment the heat sink includes a plurality of plugs projecting from the generally flat surface.
Claims10
A method of forming a heat sink comprising the steps of:
- (a) providing a powder comprising metal particles;
- and
- (b) at least partially fusing said metal particles into a heat sink configured to transfer heat from an integrated circuit, said heat sink comprising a plurality of posts projecting from a generally flat surface, such that at least two of said posts are formed with protrusions extending from ends thereof respectively, and a surface of said heat sink opposite to said generally flat surface is formed with apertures configured to fittingly receive respective protrusions extending from ends of posts of another heat sink which is configured similar to said heat sink.
Dependencies are inferred from the claim text.