Electroplating bath for the electrodeposition of silver-tin alloys
AssigneeW. C. Heraeus GmbH
InventorsGunter Herklotz, Thomas Frey, Wolfgang Hempel
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Abstract
Silver-tin alloys can be deposited by the galvanic method from a cyanide-free bath which is prepared using silver as the nitrate or diammine complex, tin as the soluble tin(II) or tin(IV) compound and mercaptoalkane-carboxylic acids and -sulfonic acids, Uniform and adhering coatings of silver-tin alloys with a silver content of approximately 20 to 99 weight % can be deposited from said bath. Silver-tin alloys are electrodeposited from said bath at a pH of 0 to 14 and a current density of 0.1 to 10 A/dm.sup.2.
Claims16
An aqueous bath for the electrodepostion of silver-tin alloys said aqueous bath having a pH of 0 to 14 and comprising
- 120 g/l of silver as a soluble silver compound,
- 100 g/l of tin as a soluble tin compound,
- 450 g/l of at least one mercapto compound selected from the group consisting of mercaptoalkanecarboxylic acids, mercaptoalkanesulfonic acids, and salts of said acids, and
- 0 to 200 g/l of at least one compound selected from the group consisting of conductivity acids and conductivity salts.
Dependencies are inferred from the claim text.