Method of forming a heat-sinked electronic component
AssigneeSaint-Gobain/Norton Industrial Ceramics Corporation
InventorMatthew Simpson
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Abstract
A method for forming a heat-sinked electronic component includes the following steps: depositing, at a first deposition rate, a first layer of synthetic diamond having a relatively high thermal conductivity; depositing, on the first layer, at a second deposition rate that is higher than the first deposition rate, a second layer of synthetic diamond having a relatively low thermal conductivity; and mounting an electronic component on the first layer of synthetic diamond. Alternatively, the layers may be deposited in the opposite order.
Claims17
A method of forming a heat-sinked electronic component, comprising the steps of:
- depositing, at a first deposition rate, a first layer of synthetic diamond having a first thermal conductivity;
- depositing, on said first layer, at a second deposition rate that is higher than said first deposition rate, a second layer of synthetic diamond having a second thermal conductivity;
- the said first thermal conductivity being at least fifteen percent higher than said second thermal conductivity;
- and
- mounting an electronic component on said first layer of synthetic diamond.
A method of producing a heat-sinked electronic component, comprising the steps of:
- depositing adjacent layers of synthetic diamond having substantially different thermal conductivities, by depositing one of said layers at a first deposition rate to obtain synthetic diamond having a first thermal conductivity, and depositing the other of said layers at a second deposition rate to obtain synthetic diamond having a second thermal conductivity;
- said first deposition rate being higher than said second deposition rate, and said second thermal conductivity being at least fifteen percent higher than said first thermal conductivity;
- and
- mounting said electronic component on said other of said layers.
Dependencies are inferred from the claim text.