Brazeless ceramic-to-metal bond for use in implantable devices
AssigneeAdvanced Bionics AG
InventorRichard P. Malmgren
Life of this patent
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Abstract
In a method and apparatus for forming a hermetically sealed bond for use in implantable medical devices, a first structure, made from a first material, is positioned against a second structure, made from a second material. A compressive force directed at the second structure is applied to the first structure, and an equal force directed at the first structure in a direction opposite the compressive force is applied to the second structure so that the first and second structures are isodynamically pressed together. The first and second structures are heated to a diffusion temperature whereat the first material and the second material undergo diffusion, thereby forming a hermetically sealed bond between the first and second materials.
Claims15
A method of forming a hermetically sealed bond between materials including:
- positioning a first structure against a second structure, the first structure including a first material and the second structure including a second material;
- applying a compressive force to the first structure, the compressive force being directed at the second structure;
- applying an equal force to the second structure, the equal force being directed at the first structure and being in a direction opposite the compressive force;
- heating the first and second structures to a diffusion temperature whereat the first material and the second material undergo diffusion so as to cause a hermetically sealed bond between the first and second materials;
- whereby the hermetically sealed bond is formed between the first and second structures.
A method of forming a hermetically sealed bond between a first structure and a second structure, the method including:
- compressing isodynamically a first structure against second structure, so as to isodynamically press the first structure and the second structure together at a bonding junction;
- and
- heating the first and second structures to a diffusion temperature, the first structure including a first material and the second structure including a second material, the first material and the second material undergoing diffusion in response to the heating, and the diffusion causing a hermetically sealed bond between the first and second materials;
- whereby a hermetically sealed bond is formed between the first structure and the second structures.
Dependencies are inferred from the claim text.