Bonding apparatus
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorYasuto Onitsuka
Life of this patent
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Abstract
An outer-lead bonding apparatus according to the present invention comprises: (1) a punching die to stamp out chips from a film carrier tape, (2) a mounter to mount TAB chips on a substrate, (3) a first cover to enclose the mounter, (4) a second cover to enclose the punching die, (5) a pressure regulator to supply higher air pressure than outer air into inside space of the first cover, and (6) a exhaust to exhaust air from inside space of the second covering means. The outer-lead bonding apparatus of this invention keeps the environment around the mounter clean with air supplied from a pressure regulator and also by exhausting the air polluted by the punching operation through the exhaust. Neither products nor outer environment is thus contaminated.
Claims8
An outer-lead bonding apparatus comprising:
- a punching die to stamp chips from a film carrier tape,
- a mounter to mount a TAB chip onto a substrate;
- a cover to enclose the punching die;
- and
- an exhaust to exhaust air from an inside space of the cover.
An outer-lead bonding apparatus comprising:
- a punching die to stamp chips from a film carrier tape;
- a mounter to mount the punched TAB chips on a substrate;
- a first cover to enclose the mounter;
- a second cover to enclose the punching die;
- and
- an exhaust to exhaust air inside of the second cover.
An outer-lead bonding apparatus comprising:
- a punching die to stamp out chips from a film carrier tape;
- a mounter to mount the punched TAB chips on a substrate;
- a first cover to enclose the mounter;
- a second cover to enclose the punching die;
- and
- a pressure regulator to supply higher pressurized air to an inside space of the first cover than that outside the first cover;
- and
- an exhaust means to exhaust air inside of the second cover.
A method of bonding punched chips on a substrate comprising the steps of:
- enclosing a TAB chip mounter within a first cover;
- enclosing a punching die for stamping TAB chips from a film carrier within a second cover;
- supplying air of a higher pressure than air on the outside of the first cover to the inside of the first cover;
- and
- exhausting air from the inside of the second cover.
Dependencies are inferred from the claim text.