Method of reworking bonded lead wires

A method of removing a plurality of outward extending leads of an electrical circuit device from respective bonding pads to which they are bonded, comprising:

• (a) aligning a shearing tool with a first lead of said plurality of leads above the respective bonding pad of said first lead by:
• (1) aligning said shearing tool over a reference surface located vertically below a level of said first lead;
• (2) lowering said shearing tool to contact said reference surface lateral to said first lead;
• and
• (3) lifting said shearing tool to a predetermined shearing height above said reference surface;
• (b) moving said shearing tool in a lateral direction relative to said first lead to shear said first lead from its bonding pad;
• (c) moving said shearing tool relative to said electrical circuit device to an alignment with a second lead of said plurality of said leads and lowering said shearing tool to said predetermined shearing height;
• (d) moving said shearing tool in a lateral direction relative to said second lead to shear said second lead from its bonding pad;
• and
• (e) repeating steps (c) and (d) for each successive lead of said plurality of said leads.