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AssigneeHarris Corporation
InventorGreg J. Pettit
Estimating the term…
The unwanted introduction of contaminant material into the interior of a craftsperson's telephone test set is effectively prevented by modifying the housing configuration of the hand and face-conformal segment of the test set to incorporate a resealable module that is sized to accommodate printed circuit components that are to be protected from contaminants in a compact nested arrangement. The resealable module comprises a shell configured to be insertable within a receiver-retaining portion of the test set body. The shell has an acoustic opening which is adjacent to an acoustic energy coupling portion of the test set body, when the module is inserted into the receiver-retaining portion of the test set body. The acoustic opening is configured to seal a bottom portion of the shell with the test set body. A printed circuit motherboard has a plurality of printed circuit modules and is supported on the shell, so as to provide an acoustic chamber within the interior of the shell adjacent to the acoustic opening. A module enclosure top is seated tightly against and seals the top of the shell.
A test set assembly for housing an acoustic transducer and printed circuit components within a body of a craftsperson's test set, said test set assembly comprising a resealable module that is configured to be inserted into an acoustic transducer-containing portion of said body, said resealable module having an acoustic opening adjacent to an acoustic energy coupling portion of said body, and an acoustic transducer-receiving portion adjacent to said acoustic opening, said acoustic transducer-receiving portion being sized to accommodate an acoustic transducer, and a first seal element which is configured and is made of a material which snugly engages said acoustic transducer-receiving portion and said acoustic transducer-containing portion of said test set body, and provides a first seal against the introduction of dust and moisture contaminants into said module when said module is inserted into said acoustic transducer-containing portion of said test set body, a printed circuit board having a printed circuit arranged thereon, and being supported within said module relative to said acoustic transducer-receiving portion, so as to provide an acoustic chamber within said module adjacent to said acoustic opening thereof, said acoustic chamber providing for acoustic vibration adjacent to said acoustic transducer, a module enclosure top configured to be seated tightly against and close said module, and a second seal element, which is configured and is made of a material that is captured between said module enclosure top and said module and provides a second seal against the introduction of dust and moisture contaminants into said module.
A test set assembly for housing an acoustic transducer and printed circuit components within a body of a craftsperson's test set comprising a resealable module that is configured to be inserted into an acoustic transducer-containing portion of said test set body, said resealable module including a shell portion configured to be insertable within and readily nest in proximity to the interior periphery of said acoustic transducer-containing portion of said test set body, said shell portion having an acoustic opening coupled with said acoustic transducer adjacent to an acoustic energy coupling portion of said test set body, and an acoustic transducer-receiving portion adjacent to said acoustic opening, said acoustic transducer-receiving portion being provided at a bottom portion of said shell portion and being sized to accommodate said acoustic transducer, and a first seal element which is configured and is made of a material which snugly engages said acoustic transducer-receiving portion and an interior surface of said acoustic transducer-containing portion of test set body, and provides a first seal against the introduction of dust and moisture contaminants into said module when said shell portion is inserted into said acoustic transducer-containing portion of said test set body, a printed circuit motherboard having a plurality of printed circuit modules arranged thereon, and being supported with respect to said shell portion, so as to provide an acoustic chamber within the interior of said shell portion adjacent to said acoustic opening of said shell portion, said acoustic chamber providing for acoustic vibration adjacent to said acoustic transducer, a module enclosure top configured to be seated tightly against said shell portion, and a second seal element, which is configured and is made of a material that is captured between said module enclosure top and said shell portion and provides a second seal against the introduction of dust and moisture contaminants into said module.
A test set assembly for housing an acoustic transducer and printed circuit components within a body of a craftsperson's test set, said test set assembly comprising a resealable module that is configured to be inserted into an acoustic transducer-containing portion of said test set body, said resealable module including a shell portion configured to be insertable within and readily nest in proximity to the interior periphery of said transducer-containing portion of said test set body, said shell portion having an acoustic transducer-receiving portion configured to receive said acoustic transducer adjacent to an acoustic energy coupling portion of said test set body, and a first seal element which is configured and is made of a material which engages said acoustic transducer-receiving portion and an interior surface of said acoustic transducer-containing portion of said test set body, and provides a first seal against the introduction of dust and moisture contaminants into said module when said shell portion is inserted into said acoustic transducer-containing portion of said test set body, a printed circuit motherboard having a plurality of printed circuit modules arranged thereon, and being supported with respect to said shell portion, so as to provide an acoustic chamber within interior of said shell portion adjacent to said acoustic opening of said shell portion, which acoustic chamber provides for acoustic vibration adjacent to said acoustic transducer, a removable module enclosure top configured to close said shell portion, and wherein said shell portion further includes an opening through which a cable connected to said printed circuit motherboard passes for connection to circuit components external to said module, and sealant material which is configured to seal said opening through which said cable passes, and provide a second seal against the introduction of dust and moisture contaminants into said module.
Dependencies are inferred from the claim text.