Packaging of high power semiconductor lasers
AssigneeCorning Incorporated
InventorPaul A. Jakobson
Life of this patent
Estimating the term…
Abstract
A package for a high power semiconductor laser comprising a hermetically sealed container filled with a dry gaseous medium containing oxygen. The presence of oxygen in the laser atmosphere is counter to standard practice in the art which teaches the use of an atmosphere of a dry inert gas. The package also includes a getter for organic impurities, e.g., a getter composed of a porous silica or a zeolite. The hydrogen content of the materials used to form the package are reduced by baking at an elevated temperature for an extended period of time, e.g., at 150.degree. C. for 200 hours.
Claims2
A packaged high power semiconductor laser comprising:
- (A) a semiconductor laser which comprises a GaAs substrate, said laser having an operating optical power of at least 50 milliwatts;
- and
- (B) a hermetically sealed container surrounding the semiconductor laser and filled with a gaseous medium having an oxygen content of at least 100 parts per million.
A method for packaging a high power semiconductor laser comprising:
- (A) fixedly positioning a semiconductor laser which comprises a GaAs substrate in a container, said laser having an operating optical power of at least 50 milliwatts;
- (B) introducing a gaseous medium into said container, said gaseous medium having an oxygen content of at least 100 parts per million;
- and
- (C) hermetically sealing the container.
Dependencies are inferred from the claim text.