Power module using IMS as heat spreader

Abstract

In the present invention, a heat spreader, circuit boards for power semiconductor elements, and a circuit board for a control circuit are fixed on a metal plate. The heat spreader is made of an IMS. The IMS has a metal base made of Cu or Cu clad plate, and a high heat radiating insulating layer made of a resin-based material, and the metal plate and the heat spreader are adhered by the high heat radiating insulation layer and electrically insulated from each other. Only a power semiconductor element is soldered onto the heat spreader. A wiring pattern for guiding each terminal of the power semiconductor element to the outside is formed on a power circuit board. A control circuit for controlling the power semiconductor element is formed on the circuit board for the control circuit.

Dependencies are inferred from the claim text.