Probe with reduced input capacitance

An electrical test probe comprising:

• a probe tip including:
• a probe input conductor, conductive shield means for shielding said probe input conductor;
• a middle conductor having a preselected thickness and shape such that it is substantially located on an equipotential surface between said probe input conductor and said conductive shield means, wherein said equipotential surface is defined by an electrical field between said probe input conductor and said conductive shield means in the absence of the middle conductor;
• dielectric means for insulating said middle conductor from said probe input conductor and said conductive shield means, wherein said middle conductor comprises a thin film of conductive material formed on said dielectric means;
• a probe amplifier circuit having an input electrically coupled to said probe input conductor and to said middle conductor;
• and
• a frequency compensation capacitor having a first electrode formed by said middle conductor and having a second conductor formed by said probe input conductor.

An electrical test probe comprising:

• a probe tip including:
• a probe input conductor, conductive shield means for shielding said probe input conductor;
• a middle conductor having a preselected thickness and shape such that it is substantially located on an equipotential surface between said probe input conductor and said conductive shield means, wherein said equipotential surface is defined by an electrical field between said probe input conductor and said conductive shield means in the absence of the middle conductor;
• dielectric means for insulating said middle conductor from said probe input conductor and said conductive shield means;
• a probe amplifier circuit having an input electrically coupled to said probe input conductor and to said middle conductor, wherein said probe amplifier circuit has a capacitance C.sub.X and said test probe an attenuation factor A, said test probe has a length (l) said probe input conductor has a radius r.sub.0, said shield means is located at a radius r.sub.2 from said probe input conductor, and said equipotential surface is located at a distance r.sub.1 from said probe input conductor where r.sub.1 is selected to satisfy the
• equation
• A= 1+ln(r.sub.1 /r.sub.0)/ln(r.sub.2 /r.sub.1)+(C.sub.x)ln(r.sub.1 /r.sub.0)/2 .pi..di-elect cons.1!.sup.-1 ;
• and
• a frequency compensation capacitor having a first electrode formed by said middle conductor and having a second conductor formed by said probe input conductor.

A method of forming a frequency compensation capacitor for an electrical test probe, said method comprising the steps of;

• providing a probe input conductor having a first end near a tip of the electrical test probe and a second end for coupling to a test instrument, said probe input conductor being highly conductive from said first end to said second end;
• shielding said probe input conductor with a shield conductor;
• and
• forming a middle conductor between said probe input conductor and said shield conductor so that the middle conductor is insulatingly spaced from the input conductor from said first end to said second end, a portion of said middle conductor near said second end being adapted to couple to said test instrument, said middle conductor having a preselected thickness and shape such that it is substantially located on an equipotential surface defined by the electrical field between said probe input conductor and said shield conductor.

An electrical test probe comprising:

• a probe input conductor having a first end for probing a circuit under test, and a second end for coupling to a probe amplifier circuit;
• a first insulating plastic layer having a first thickness covering the probe input conductor and having a length extending from the second end towards the first end of the probe input conductor, wherein the first end of the probe input conductor extends beyond the first insulating plastic layer;
• a thin film middle conductor formed on the first insulating plastic layer extending along the length of the first insulating plastic layer over the second end of the probe input conductor and having a portion near the second end for coupling to a probe amplifier circuit;
• a second insulating plastic layer having a second thickness covering the thin film middle conductor;
• conductive shield means formed on the second insulating plastic layer for shielding said probe input conductor such that the thin film middle conductor is located between the probe input conductor and the conductive shield means along the length of the first insulating plastic layer, the thin film middle conductor having a preselected thickness and shape such that it is substantially located on a equipotential surface defined by the electrical field between the probe input conductor and the conductive shield means.