Back to results
US 5,512,613 AGranted
Cleavable diepoxide for removable epoxy compositions
AssigneeInternational Business Machines Corporation
InventorsAli Afzali-Ardakani, Stephen L. Buchwalter, Jeffrey D. Gelorme, Laura L. Kosbar, Bert H. Newman, Frank L. Pompeo
Life of this patent
Estimating the term…
Abstract
A cleavable epoxy resin composition suitable for encapsulating electronic chips comprising the cured reaction product of a diepoxide containing a cyclic anhydride curing agent and an amine promoter.
Claims11
A cured diepoxide composition which is capable of being readily cleaved and removed in acidic solvents, comprising the reaction product of:
- a diepoxide in which the organic linking moiety which is the connection between the two epoxy groups of the diepoxide includes an acyclic acetal group;
- a cyclic dicarboxylic anhydride curing agent or mixture of cyclic dicarboxylic acid anhydride curing agents present at a concentration such that the anhydride/diepoxide ratio of equivalents is less than or equal to 0.90;
- a 1,3-diaza compound having two nitrogen atoms present with one nitrogen atom doubly bonded to a central carbon and singly bonded to one other carbon, and the other nitrogen atom singly bonded to the central carbon and singly bonded to two other carbons, said 1,3-diaza compound serving either as the sole catalyst or in combination with a tertiary amine catalyst which is different from said diaza compound;
- and a hydroxy functional initiator.
1 more element
Dependencies are inferred from the claim text.