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US 5,512,381 AGranted
Copper foil laminate for protecting multilayer articles
AssigneeAlliedSignal Inc.
InventorsJiri D. Konicek, Donald E. Yuhas
Life of this patent
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Abstract
A method for making multilayer laminates having at least one exposed layer of copper foil. The exposed layer of copper foil is covered with a adhesively attached protective metal sheet made of a copper prior to being laminated.
Claims1
A protected sheet of copper foil for manufacturing multilayer laminates comprising:
- (a) a sheet of copper foil having a thickness greater than about 8 .mu.m and having a first face adapted for adhering to a fiber reinforced polymer layer and a second protected face to be exposed after said first face is adhered to said fiber reinforced polymer layer;
- (b) a protective sheet of copper having a thickness of about 8 to 250 .mu.m covering said second copper foil face and adhesively attached thereto by a non-metallic adhesive in areas where circuit patterns are not to be developed.
Dependencies are inferred from the claim text.