Epoxy resin composition and applications, in particular in composite structures, using imidazole/polyamine mixture
AssigneeBrochier S.A.
InventorsIsabelle Blanc, Fran.cedilla.oise Eyriey, Xavier Gambert
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Abstract
Hardenable or polymerizable epoxy resin-based composition, characterized in that its hardener system comprises a combination in synergic quantities of: (i) at least one imidazole which, alone, can cause the polymerization of the epoxy resin only at a temperature above about 75.degree. C., (ii) at least one polyamine compound which, alone, leads to the polymerization of the epoxy resin at a temperature lower than about 75.degree. C. Such a resin is particularly suitable for the manufacture of composite structures, applicable in particular in ship- or boatbuilding.
Claims17
A hardenable or polymerizable epoxy composition comprising an epoxy resin and about 5 to about 50 wt % of a hardener based on the total weight of the composition, said hardener including the combination of:
- (i) at least one imidazole that only polymerizes said epoxy resin at temperatures above 75.degree. C.;
- and
- (ii) at least one polyamine that only polymerizes said epoxy resin at temperatures below 75.degree. C.;
- said composition having a lifetime of at least 21 days and being polymerizable in a single step at 75.degree. C.
A hardenable or polymerizable epoxy composition comprising an epoxy resin and about 5 to about 50 wt % hardener, based on the total weight of the composition, said hardener including:
- (i) at least one imidazole that only polymerizes said epoxy resin at temperatures above 75.degree. C.;
- and
- (ii) at least one polyamine that only polymerizes said epoxy resin at temperatures below 75.degree. C.;
- and said composition having:
- (iii) a lifetime of at least 21 days;
- (iv) a humidity uptake less than 1% based upon aging in water at 70.degree. C. for 14 days in accordance with standard ISO 75;
- (v) moldability at pressures from about 0.4 to 0.9 bars absolute;
- and
- (vi) adhesiveness to foams formed from polyurethane or polyvinyl chloride, or honeycombs formed from aluminum, polyolefins or aramid fibers;
- and permitting single step polymerization at temperatures from 75.degree. C. to 120.degree. C.
An epoxy containing substrate comprising,
- (i) a substrate material selected from polyester, polyamide, aramid, carbon, silicon or glass and being woven or non-woven;
- and
- (ii) a hardenable or polymerizable epoxy composition comprising an epoxy resin and about 5 to about 50 wt % hardener, based on the total weight of the composition, said hardener including:
- (a) at least one imidazole that only polymerizes said epoxy resin at temperatures above 75.degree. C.;
- and
- (b) at least one polyamine that only polymerizes said epoxy resin at temperatures below 75.degree. C.;
- said composition having a lifetime of at least 21 days and being polymerizable in a single step at 75.degree. C.
Dependencies are inferred from the claim text.