Methods for making circuit boards by vacuum impregnation
AssigneeCompositech, Inc.
InventorsJonas Medney, Fred E. Klimpl
Life of this patent
Estimating the term…
Abstract
A warp-free laminate is produced by winding a first set of strands or filaments about a flat mandrel with a second set of strands being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern determining punching out or high speed drilling of hole openings for subsequent printed circuit applications.
Claims9
A method of making a multilayer printed circuit board in which the components thereof are secured within a single phase settable matrix comprising:
- providing a plurality of printed circuit boards each having a circuit printed on at least one side;
- fixing the plurality of printed circuit boards relative to each other such that said circuits are in proper registration and a desired spaced relation with respect to each other;
- providing non-conductive separators between the opposed surfaces of the printed circuit boards;
- introducing a settable matrix material around and between said printed circuit boards and separators while maintaining them under vacuum conditions, thereby completely filling the voids between and around the printed circuit boards;
- and
- curing the settable matrix material to form a multilayer circuit board.
A method of making a multilayer printed circuit board in which the components thereof are secured within a settable matrix comprising:
- fixing a plurality of printed circuit boards each having a circuit printed on at least one side in spaced relation using non-conductive separators such that said circuits are in registration;
- introducing a settable matrix material around and between said printed circuit boards and separators while maintaining them under vacuum conditions, thereby completely filling the voids between and around the printed circuit boards;
- and
- curing the settable matrix material to form a multilayer circuit board.
A method of making a multilayer printed circuit board comprising arranging two plates in spaced relation, arranging a parametrial seal between the plates with an upper opening in the seal to form an upwardly open chamber, placing a plurality of printed circuit boards between the plates in spaced relation to one another using nonconductive spacers, injecting a settable matrix material into the chamber and around the boards and spacers in a manner sufficient to achieve a void-free composite, compressing the end plates towards each other to achieve the desired outer dimensions of the board, and curing the settable matrix material to set the same.
Dependencies are inferred from the claim text.