Solder and tin stripper composition
AssigneeApplied Chemical Technologies, Inc.
InventorsRajwant Singh, Nenad Mandich, Gerald A. Krulik
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AssigneeApplied Chemical Technologies, Inc.
InventorsRajwant Singh, Nenad Mandich, Gerald A. Krulik
Estimating the term…
A metal dissolving liquid and method for stripping tin and solder coatings, including the underlying tin-copper alloy, from the copper substrate of a printed circuit board. The liquid includes an aqueous solution of nitric acid in an amount sufficient to dissolve solder and tin, a source of ferric ions in an amount sufficient to dissolve tin-copper alloy, a source of halide ions in an amount sufficient to solubilize tin, an effective amount of methylsulfonic acid as promoter for complete stripping, and a source of an organic, water soluble amine. The combination of ingredients will substantially eliminate sludge formation, reduce attack on the copper substrate and provide a bright copper finish after solder removal. A liquid further including organic triazoles including benzotriazole in amounts not more than about 5% by weight and sulfamic ions in amounts not more than about 2.5% by weight.
A metal dissolving liquid for stripping tin, solder and the underlying tin-copper alloy from the copper substrate of a printed circuit board, consisting essentially of an aqueous solution of
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