Masking of circuit board vias to reduce heat-induced board and chip carrier package warp during wavesolder process

A method of manufacturing a circuit assembly, comprising the steps of:

• constructing a printed circuit board, said circuit board comprising a stacked plurality of circuit patterns interposed by one or more insulating layers and a plurality of plated, open through vias interconnecting said circuit patterns, said printed circuit board having two opposed surfaces for receiving components, said circuit patterns and open through vias including circuit patterns and open through vias for receiving and connecting a ball grid array packaged component to a first surface of said printed circuit board, said ball grid array open through vias being located in a landing area defined by the border of said ball grid array packaged component;
• covering said ball grid array open through vias with an insulating material applied on the second surface of said printed circuit board without filling the vias;
• installing and soldering components, including a ball grid array packaged component, on said first surface of said printed circuit board;
• installing any components on said second surface of said printed circuit board;
• and
• wavesoldering said second surface of said printed circuit board after installation of said components and covering said ball grid array open through vias.