Lead frame material and lead frame for semiconductor device

A lead frame for semiconductor device comprising:

• a lead frame body having inner leads to be wire-bonded and outer leads to be bonded to circuit patterns of a printed circuit board, said frame body consisting of copper or copper alloys;
• first protective coatings formed by vapor deposition on surfaces of said inner leads of said lead frame body;
• and
• intermediate coatings formed between said surfaces of said inner leads and said first protective coatings;
• wherein said first protective coatings are composed of a metal selected from the group consisting of gold, gold alloy, silver, silver alloy, palladium and palladium alloy, said protective coating has a thickness of 10-500 angstrom, and said intermediate coatings are composed of nickel or nickel alloys and have a thickness of 50-20,000 angstrom.