Thermally conductive materials containing titanium diboride filler
AssigneeChomerics, Inc.
InventorGary J. Litman
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Abstract
Titanium diboride (TiB.sub.2) is used as a thermally conductive, filler in thermally conductive materials. The TiB.sub.2 provides improved thermal conductivity in comparison to conventional thermally conductive, electrically insulative or thermally conductive electrically conductive fillers especially at low application pressures. The materials into which the TiB.sub.2 filler is incorporated includes elastomers, films and tapes.
Claims20
A thermally conductive of pressure sensitive adhesive tape having both thermal conductance and adhesion, said thermally conductive, pressure sensitive adhesive tape comprising a combination including a pressure sensitive adhesive resin binder and titanium diboride particles distributed throughout the pressure sensitive adhesive resin binder.
A thermally conductive pressure sensitive adhesive tape, comprising at least one layer of a pressure sensitive adhesive resin binder containing titanium diboride particles distributed throughout the pressure sensitive adhesive resin binder and at least one thermally conductive support layer to increase the mechanical strength of the tape.
Dependencies are inferred from the claim text.